Packaging method of electronic component

Packaging method of electronic component

  • CN 1,947,480 B
  • Filed: 10/12/2005
  • Issued: 01/04/2012
  • Est. Priority Date: 10/12/2004
  • Status: Active Grant
First Claim
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1. the installation method of an electronic unit;

  • Its electronic unit that will have terminal in the side utilizes solder bonds to be installed on the electrode of substrate;

    It is characterized in that, comprising;

    the solder cream working procedure of coating, its solder cream that will in the thermohardening type solder flux, sneak into semiconductor particles is coated on the electrode of substrate;

    The electronic unit assembly process;

    It makes the terminal of said electronic unit contact with solder cream on being applied to said electrode;

    And, under the state that forms the gap between the part of said electronic unit and the relative said substrate, said electronic unit is assemblied on the said substrate;

    And heating process, it heats said substrate and makes the melt solder of said solder cream, the thermohardening type solder flux that makes said solder cream flow and be immersed in the said gap and after hot curing,Wherein, said solder cream contains the plasticizer that the solid resin by thermoplasticity constitutes, and the liquidus temperature that makes said scolder is more than the softening temperature of the said plasticizer that constitutes of the solid resin of thermoplasticity.

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