Light emitting diode component

Light emitting diode component

  • CN 1,969,369 A
  • Filed: 04/25/2005
  • Published: 05/23/2007
  • Est. Priority Date: 04/26/2004
  • Status: Active Application
First Claim
Patent Images

1. luminous encapsulation comprises:

  • Printed circuit board (PCB), it supports at least one luminous die, and has at least two power connection ends, and the printed circuit of described printed circuit board (PCB) is connected described at least one luminous die at least with described two power connection ends, to provide electric energy to it;

    Diffuser, it is arranged on described at least one luminous die top, but not above described at least two power connection ends, described cover has the openend of the cover periphery that qualification links to each other with described printed circuit board (PCB), and the inner surface of described cover limits the internal capacity that comprises described at least one luminous die with described printed circuit board (PCB);

    AndSealant, it is arranged in the described internal capacity, and covers described luminous die at least.

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