Reinforced polyamide moulding materials

Reinforced polyamide moulding materials

  • CN 1,974,665 A
  • Filed: 11/17/2006
  • Published: 06/06/2007
  • Est. Priority Date: 11/18/2005
  • Status: Active Application
First Claim
Patent Images

1. , a kind of very rigidity and the reinforced polyamide moulding material of high tenacity simultaneously, it is characterized in that:

  • its heat-drawn wire value HDT/A (1.8MPa) (measuring according to ISO

         75) is greater than 242 ℃

    , particularly at least 245 ℃

    , HDT/C (8MPa) is greater than 165 ℃

    , particularly greater than 190 ℃

    with contain the polyamide substrate of following component mixture;

    (A) polyamide 66,(B) copolyamide, it consists of;

    (b1) 70~

    30 weight parts, particularly 55~

    45 weight parts by terephthalic acid (T) and hexanediamine (6) with the approximate unit that waits molar ratio to derive and obtain,(b2) 30~

    70 weight parts, particularly 45~

    55 weight parts by hexanodioic acid (I) and hexanediamine with the approximate unit that waits molar ratio to derive and obtain,Component (b1) and weight part summation (b2) are 100 weight parts,With the filler component that contains following mixture;

    (C) glass fibre and(D) carbon fiber,The weight percent summation of component (A)~

    (D) is 100%, and said components (A), (B), (C) and (D) meet the following conditions;

    (A)+(B);

    by weight 20~

    60%,(A)/(B) weight ratio;

    50/50~

    95/5,(C)+(D);

    by weight 40~

    80%,(C)/(D) weight ratio;

    80/20~

    95/5,Except said components (A)~

    (D), described polyamide molding material randomly contains additive (E), and the amount of described additive is the summation of component (A)~

    (D).

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