High-temperature solder, high-temperature solder paste and power semiconductor device using same

High-temperature solder, high-temperature solder paste and power semiconductor device using same

  • CN 1,978,122 A
  • Filed: 12/05/2006
  • Published: 06/13/2007
  • Est. Priority Date: 12/05/2005
  • Status: Active Application
First Claim
Patent Images

1. a soldering tin material is the main composition element with Sn, Sb, Ag and Cu, it is characterized in that:

  • The composition of this soldering tin material is;

    42wt%<

    Sb/ (Sn+Sb)≤

    48wt%, and 5wt%≤

    Ag<

    20wt%, 3wt%≤

    Cu<

    10wt%, and 5wt%≤

    Ag+Cu≤

    25wt%, remaining part is made of other unavoidable impurities element.

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