Semiconductor device and electronic control unit using the same

Semiconductor device and electronic control unit using the same

  • CN 1,979,836 A
  • Filed: 12/05/2006
  • Published: 06/13/2007
  • Est. Priority Date: 12/09/2005
  • Status: Active Application
First Claim
Patent Images

1. , a kind of semiconductor device has:

  • Dispose the substrate of circuit at first interarea;

    Semiconductor element, it is arranged on described first interarea of described substrate, and is electrically connected by between line pressure welding and the described circuit;

    Metal core layer, it is arranged on the inside of described substrate, and is electrically connected with described semiconductor element;

    A plurality of conductivity projections, it is arranged on second interarea with the described first interarea opposition side of described substrate;

    The thermosetting sealing resin, it seals the described first interarea side of described semiconductor element and described substrate at least;

    WithHardware, it is arranged on described second interarea, and is electrically connected with described metal core layer.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×