Internal connection-wire structure and its mfg. method

Internal connection-wire structure and its mfg. method

  • CN 1,979,838 A
  • Filed: 12/09/2005
  • Published: 06/13/2007
  • Est. Priority Date: 12/09/2005
  • Status: Active Application
First Claim
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1. an internal connection-wire structure is positioned on the substrate, comprise a conductive part on this substrate, and this internal connection-wire structure comprises:

  • One dielectric layer is disposed on this substrate, and covers this conductive part;

    One compound connector is disposed in this dielectric layer, and electrically connects this conductive part, and this compound connector from bottom to top comprises one first connector and one second connector, and the material of this second connector and this first connector is different or critical size is different;

    AndOne lead is disposed on this dielectric layer, and electrically connects this compound connector.

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