Semiconductor device

Semiconductor device

  • CN 1,988,137 B
  • Filed: 10/13/2006
  • Issued: 11/16/2011
  • Est. Priority Date: 12/19/2005
  • Status: Active Grant
First Claim
Patent Images

1. semiconductor device wherein is provided with:

  • Heating panel;

    Cement in wiring pattern layer on the described heating panel across insulating barrier;

    Be installed in the semiconductor element that comprises at least one surface electrode on the described wiring pattern layer;

    The conductive lead plate that on the surface electrode of described semiconductor element, is electrically connected;

    AndConstitute by the anisotropic thermoplastic resin of linear expansivity, at least a portion with described heating panel, described wiring pattern layer, described semiconductor element and described conductive lead plate be enclosed in interior and resin package covers that be shaped,It is characterized in that;

    described conductive lead plate becomes maximum direction extension along the linear expansivity of described resin package covers.

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