Compound film without glue

Compound film without glue

  • CN 201,026,688 Y
  • Filed: 01/17/2007
  • Issued: 02/27/2008
  • Est. Priority Date: 01/17/2007
  • Status: Active Grant
First Claim
Patent Images

1. no glue laminated film is characterized in that:

  • it comprises that base layer (1) and coextru-lamination go up and can be directly and paper wood, preprint paper wood, sheet metal, preprint sheet metal or contain the compound functional layer (2) of film of this layer at base layer (1).

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×