Metal base cover layer used for printed circuit board

Metal base cover layer used for printed circuit board

  • CN 201,491,371 U
  • Filed: 04/16/2009
  • Issued: 05/26/2010
  • Est. Priority Date: 04/16/2009
  • Status: Active Grant
First Claim
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1. Metal Substrate coverlay that is used for printed circuit board (PCB), it is characterized in that, described Metal Substrate coverlay comprises metallic film (1), adhesive (2) and release liners (3), wherein, by going up adhesive coating (2) at described metallic film (1), and on described adhesive (2), be laminated with described release liners (3), obtain described Metal Substrate coverlay.

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