LED light source package potting structure

LED light source package potting structure

CN
  • CN 201,594,554 U
  • Filed: 01/23/2010
  • Issued: 09/29/2010
  • Est. Priority Date: 01/23/2010
  • Status: Active Grant
First Claim
Patent Images

1. a led light source encapsulation encapsulating structure comprises package floor and the stacked package frame that has electrode thereon, and it is characterized in that:

  • described package frame is provided with glue filling opening and steam vent;

    Also be provided with corresponding glue filling opening and steam vent on the described package floor;

    The glue filling opening of described package frame is connected with the glue filling opening of package floor;

    The steam vent of described package frame is connected with the steam vent of package floor.

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