Silicon microphone and packaging structure applied to silicon microphone products

Silicon microphone and packaging structure applied to silicon microphone products

  • CN 201,898,612 U
  • Filed: 09/03/2010
  • Issued: 07/13/2011
  • Est. Priority Date: 09/03/2010
  • Status: Active Grant
First Claim
Patent Images

1. silicon microphone, comprise shell and wiring board, described shell and wiring board constitute the outer enclosure structure of silicon microphone, PCB surface in described encapsulating structure inside is equipped with the MEMS chip, and described encapsulating structure is provided with the sound hole that is used to receive the external sound signal, it is characterized in thatThe exterior circumferential surface in described sound hole is provided with the dark colour coating.

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