Silicon capacitive microphone with additional back cavity

Silicon capacitive microphone with additional back cavity

  • CN 201,910,913 U
  • Filed: 10/19/2010
  • Issued: 07/27/2011
  • Est. Priority Date: 10/19/2009
  • Status: Active Grant
First Claim
Patent Images

1. one kind has additional silicon condenser microphone of carrying on the back the chamber, comprising:

  • Substrate;

    The chamber tube is the tubular of an opening, and opening surface sticks on described substrate by sticker, forms additional back of the body cavity space in that tube is inner, forms through hole at the opposing face of opening surface;

    The MEMS chip covers the through hole of described chamber tube, and sticks on the opposing face of the opening surface of described chamber tube, and the sound press that will flow into from the outside is transformed into the signal of telecommunication;

    Asic chip is assembled in described substrate, provides power supply to described MEMS chip, amplifies the signal of telecommunication of described MEMS chip, and exports by the splicing ear of described substrate;

    AndShell is the tubular of an opening, and opening surface is connected with described substrate, is formed for holding the spatial accommodation of described chamber tube and MEMS chip and asic chip in inside, and the shielding external noise.

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