Micro electro mechanical microphone chip

Micro electro mechanical microphone chip

  • CN 202,957,975 U
  • Filed: 11/15/2012
  • Issued: 05/29/2013
  • Est. Priority Date: 11/15/2012
  • Status: Active Grant
First Claim
Patent Images

1. an electromechanical microphone chip, is characterized in that, comprising:

  • substrate, barrier layer, back pole plate, supporting layer, vibrating diaphragm, the first metal electrode and the second metal electrode;

    Wherein, upper surface of substrate is barrier layer, on barrier layer, is back pole plate, on back pole plate, is supporting layer, on supporting layer, is vibrating diaphragm;

    There is a through hole at the center on substrate and barrier layer, is back of the body chamber;

    There is a through hole corresponding with back of the body chamber at the center of supporting layer, makes between vibrating diaphragm and back pole plate and forms air gap, carries on the back between chamber and air gap across back pole plate;

    Back pole plate consists of conductive layer and insulating barrier, and wherein conductive layer only is arranged on the position corresponding with the vibration area of vibrating diaphragm and the position corresponding with the first metal electrode;

    The top electrode hole of vertically opening is downwards arranged on supporting layer, and the top electrode hole penetrates supporting layer, and the first metal electrode is arranged in the top electrode hole and with conductive layer and directly contacts;

    The second metal electrode is arranged on vibrating diaphragm.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×