COB packaging structure of mobile phone camera shooting module

COB packaging structure of mobile phone camera shooting module

  • CN 203,536,439 U
  • Filed: 10/25/2013
  • Issued: 04/09/2014
  • Est. Priority Date: 10/25/2013
  • Status: Active Grant
First Claim
Patent Images

1. the COB encapsulating structure of a cell-phone camera module, comprise PCB substrate (1) and be separately positioned on sensitive chip (2), discrete component (3), gold plated pads (4), the microscope base (5) on PCB substrate (1), between gold plated pads (4) and sensitive chip (2), by gold thread (6), be connected, it is characterized in that:

  • described discrete component (3) is positioned at the periphery of microscope base (5), described sensitive chip (2), gold plated pads (4) are positioned at the inner chamber of microscope base (5).

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