A kind of encapsulating structure of microphone

A kind of encapsulating structure of microphone

  • CN 204,442,695 U
  • Filed: 02/15/2015
  • Issued: 07/01/2015
  • Est. Priority Date: 02/15/2015
  • Status: Active Grant
First Claim
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1. an encapsulating structure for microphone, comprises substrate, base plate, two ends with the circuit board frame of pass through openings;

  • The two ends that described substrate and described base plate are welded in described circuit board frame respectively form host cavity, and be provided with MEMS chip and asic chip in described host cavity, the chamber wall of described host cavity is provided with acoustic aperture, it is characterized in that,The solder side of described substrate and described base plate includes dodges district and weld zone, and described weld zone is adjacent with described host cavity, described in dodge district and be positioned at outside described weld zone.

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