Multichip packaging structure and electronic equipment

Multichip packaging structure and electronic equipment

CN
  • CN 204,464,273 U
  • Filed: 01/13/2015
  • Issued: 07/08/2015
  • Est. Priority Date: 01/13/2015
  • Status: Active Grant
First Claim
Patent Images

1. a multichip packaging structure, comprising:

  • First chip, comprises earth terminal;

    WithSecond chip, comprises Signal transmissions end, and described Signal transmissions end is connected with described earth terminal, described Signal transmissions end exports the first signal to described earth terminal, described first signal is as the earth signal of described first chip, and wherein, described first signal is the signal of change.

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