Wafer board

Wafer board

  • CN 205,329,989 U
  • Filed: 02/03/2016
  • Issued: 06/22/2016
  • Est. Priority Date: 02/03/2016
  • Status: Active Grant
First Claim
Patent Images

1. a wafer board, it is characterised in that include base plate (10), zinc-plated cylinder (20), mounting ring (30) and cover plate (40);

  • Described base plate (10) is provided with air vent (11) and the locating ring (12) around described air vent (11), and described locating ring (12) is molded with described base plate (10) Integral mold;

    One end of described mounting ring (30) is socketed on the outer wall of described locating ring (12), and the other end of described mounting ring (30) is socketed on the outer wall of described zinc-plated cylinder (20) bottom;

    The top of described zinc-plated cylinder (20) is covered by described cover plate (40), and described cover plate (40) is provided with the air-vent (41) being connected with air vent (11)。

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