Low section multi -chip packaging structure

Low section multi -chip packaging structure

  • CN 205,984,949 U
  • Filed: 08/18/2016
  • Issued: 02/22/2017
  • Est. Priority Date: 08/18/2016
  • Status: Active Grant
First Claim
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1. a kind of low section multichip packaging structure is it is characterised in that described low section multichip packaging structure at least includes oneFirst chip and one second chip:

  • Described first chip has active face and the back side of this active face relative, and the active face of described first chip or the back side setIt is equipped with groove;

    Described second chip arranges and is contained in the groove of described first chip, and described second chip has close to instituteState first surface and this first surface relative and the second surface away from described groove floor of groove floor.

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