fingerprint sensor package module

fingerprint sensor package module

  • CN 206,363,331 U
  • Filed: 09/23/2016
  • Issued: 07/28/2017
  • Est. Priority Date: 09/23/2016
  • Status: Active Grant
First Claim
Patent Images

1. fingerprint sensor package module, it is characterised in that including:

  • Dielectric cover plate, it has the first surface and second surface being oppositely arranged;

    Supporting construction, with the supporting surface with the bonding of the first surface of the dielectric cover plate and the bottom being oppositely arranged with supporting surfaceFace;

    Fingerprint sensor, with the sensitive face and non-sensitive face being oppositely arranged, the first table of the sensitive face and dielectric cover plateFace is bonded.

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