Flexible substrate

Flexible substrate

  • CN 206,713,159 U
  • Filed: 12/31/2015
  • Issued: 12/05/2017
  • Est. Priority Date: 12/31/2015
  • Status: Active Grant
First Claim
Patent Images

1. a kind of flexible substrate, including:

  • Organic polymer film;

    Conductive seed layer, the conductive seed layer include ion implanted layer, the plasma being attached on the ion implanted layerSedimentary;

    AndMetal thickening layer, the metal thickening layer are formed above the conductive seed layer.

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