Improved crystal circle grinding positioning ring

Improved crystal circle grinding positioning ring

  • CN 2,550,898 Y
  • Filed: 06/06/2002
  • Issued: 05/14/2003
  • Est. Priority Date: 06/06/2002
  • Status: Active Grant
First Claim
Patent Images

1. , a kind of grinding wafer locating ring of improvement, ring body are positive circular endless loop, and its internal diameter fit wafer external diameter to be ground is characterized in that:

  • aforementioned ring body outer peripheral edges lower position is set with an annular caution line.

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