Improved structure for heat emission

Improved structure for heat emission

  • CN 2,643,481 Y
  • Filed: 07/28/2003
  • Issued: 09/22/2004
  • Est. Priority Date: 07/28/2003
  • Status: Active Grant
First Claim
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1. , a kind of structure-improved of heat radiation is installed on the electronic installation with thermolysis, it is characterized in that:

  • comprise a heat conduction projection, have a plane and a lower plane on one, this lower plane adheres to this electronic installation;

    One heat pipe, what take shape in this heat conduction projection should go up the plane, and this heat pipe periphery is streamlined;

    And the plural pieces radiating fin, take shape in this heat pipe outer wall at interval.

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