The production method of wafer

The production method of wafer

  • CN 86,107,119 A
  • Filed: 10/21/1986
  • Published: 04/29/1987
  • Est. Priority Date: 10/23/1985
  • Status: Abandoned Application
First Claim
Patent Images

1. , make a kind of method of wafer, comprising:

  • (a) provide the stretching charge bar;

    (b) end face with described charge bar is processed into first tabular surface;

    (c) become the thin slice of pre-determined thickness, thin slice tow sides to be called described first tabular surface from an end along transverse cutting described charge bar with slicing machine and through the formed cut surface of described cutting;

    (d) with described first tabular surface as reference plane, the cut surface of described thin slice is processed into second tabular surface, thereby makes wafer.

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