Back in November 2019, Bell Semiconductor, LLC (Bell Semic) began litigating the patents that the Hilco Inc. (d/b/a Hilco Global) company acquired from Broadcom, asserting nearly 20 assets from that acquisition, in overlapping sets, against Renesas (IDT), TI, NXP Semiconductors, and Microchip Technology (in that order). This past February, the only remaining open case in that campaign, the one against NXP, was stayed pending resolution of related inter partes reviews (IPRs). Bell Semic has now fired off a new round of complaints—filed in multiple judicial districts separately against AMD, Analog Devices, Infineon Technologies, KIOXIA, Marvell, Micron Technology, NVIDIA, NXP (again), Qualcomm, and Socionext and filed in the International Trade Commission (ITC) together against each of those companies as well as Acer, Bose, Lenovo (Motorola Mobility), SMC Networks (d/b/a IgniteNet), and Suteng Innovation Technology (d/b/a RoboSense)—this time over a single patent generally related to “inserting dummy metal into a circuit design”. Targeted throughout is the respective provision of semiconductor devices manufactured using certain design tools provided by various third parties, including CadenceDesign Systems, Siemens, and/or Synopsys.
Bell Semiconductor, LLC (Bell Semic) has filed three new complaints in its sole campaign, over patents received from Broadcom in December 2017, two of the complaints amended and one original, that last one adding NXP Semiconductors (6:20-cv-00210) to the litigation. The plaintiff is a member of the Hilco, Inc. (d/b/a Hilco Global) family of companies; throughout this campaign, it has targeted the provision of various semiconductor devices (e.g., controllers, MCUs, processors, SOCs, transceivers, etc.), NXP with eight patents already in suit and two newly at issue. Amended complaints, filed just last week against Renesas Electronics and its subsidiary Integrated Device Technology (IDT), also brought additional patents into the campaign.
Bell Semiconductor, LLC (Bell Semic) has added an Eastern District of Texas case against TI (2:20-cv-00048) to the suits that it brought last November against RenesasElectronics in the Middle District of Florida and Integrated Device Technology (IDT) in the District of Delaware. The plaintiff, a member of the Hilco, Inc. (d/b/a Hilco Global) family of companies, targets the provision of various semiconductor devices (e.g., controllers, MCUs, processors, SOCs, transceivers, etc.) throughout this campaign, asserting against TI five patents new to the litigation as well as four already in suit. Bell Semic received all the assets from Broadcom in December 2017.