Toshiba Accused of Infringing Chip Bonding Patent, Ten Years After Its Named Inventors First Sued the Company

August 16, 2017

Anza Technology, Inc. has filed suit against Toshiba (2:17-cv-01688) in the Eastern District of California, alleging infringement of a single patent already at issue in the NPE’s litigation campaign. The patent is generally directed to certain bonding machines and techniques, with Toshiba accused of infringement through the provision of a wide range of products allegedly using flip chip bonding techniques during manufacturing. The new case joins another filed, against Mushkin, Inc. (perhaps erroneously), in the Eastern District of California, as well as three active cases in the Southern District of California and a suit against Xilinx filed in the District of Colorado.

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