The USPTO recently made public the transfer of more than 50 US patents from Winbond Electronics (Nuvoton Technology Corporation Japan) to Advanced Integrated Circuit Process LLC (AICP), a Texas entity. The recipient has filed its first litigation, accusing TSMC (2:24-cv-00623) of infringing seven of the transferred assets in a new Eastern District of Texas complaint that targets the provision of semiconductor devices manufactured at various process nodes (i.e., the 5, 7, 10, 16, and 28 nanometer process nodes), as well as third-party electronic components (e.g., computer chips, computer graphics cards, and mobile devices)—including certain Apple, MediaTek, and NXP Semiconductors devices—that allegedly incorporate them.