Hearing aid adapted for embedded electronics
First Claim
Patent Images
1. A hearing aid comprising:
- a microphone;
a receiver;
hearing aid electronics coupled to the microphone and the receiver; and
conductive traces overlaying an insulator, the conductive traces provided using Molded Interconnect Device (MID) technology and configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator, wherein the insulator includes a hearing aid housing and wherein the hearing aid housing includes a plurality of internal cavities and the conductive traces include an inter-cavity trace configured to electrically interconnect hearing aid electronics disposed within at least two different cavities of the hearing aid housing.
2 Assignments
0 Petitions
Accused Products
Abstract
A hearing aid comprising a microphone, a receiver, hearing aid electronics coupled to the microphone and the receiver, and conductive traces overlaying an insulator, the conductive traces configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. Examples are provided wherein the insulator includes a hearing aid housing.
110 Citations
18 Claims
-
1. A hearing aid comprising:
-
a microphone; a receiver; hearing aid electronics coupled to the microphone and the receiver; and conductive traces overlaying an insulator, the conductive traces provided using Molded Interconnect Device (MID) technology and configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator, wherein the insulator includes a hearing aid housing and wherein the hearing aid housing includes a plurality of internal cavities and the conductive traces include an inter-cavity trace configured to electrically interconnect hearing aid electronics disposed within at least two different cavities of the hearing aid housing. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
-
-
13. A method of manufacturing a hearing aid, the method comprising:
-
providing a housing for the hearing aid, the housing including integrated electrical components embedded within a sidewall of the housing; and providing multi-axis conductive traces along contours of the sidewall of the housing using Molded Interconnect Device (MID) technology, the conductive traces overlaying an insulator and following non-planar contours of the insulator, the conductive traces configured to connect the integrated electrical components to hearing aid electronics within the housing using the conductive traces, wherein the housing includes a plurality of internal cavities and the conductive traces include an inter-cavity trace configured to electrically interconnect hearing aid electronics disposed within at least two different cavities of the housing. - View Dependent Claims (14, 15, 16, 17, 18)
-
Specification