Method of manufacturing electronic component
First Claim
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1. A method of manufacturing an electronic component, comprising:
- forming a magnetic body in which internal coil parts are embedded;
forming at least one laminate by stacking thermosetting resin layers on upper and lower portions of a magnetic metal plate to form each of the at least one laminate;
stacking the at least one laminate on at least one of upper and lower portions of the magnetic body thereby forming a laminated magnetic body; and
after forming the laminated magnetic body, compressing the laminated magnetic body to thereby puilverize the magnetic metal plate of the at least one laminate to have a plurality of metal fragments therein, thereby forming the at least one laminate having the pulverized metal plate stacked on the magnetic body into at least one cover part covering the magnetic body.
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Abstract
A method of manufacturing an electronic component having high inductance (L) and an excellent quality (Q) factor and direct current (DC)-bias characteristics includes forming a magnetic body in which internal coil parts are embedded, and forming a cover part including a magnetic metal plate on at least one of upper and lower portions of the magnetic body.
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Citations
17 Claims
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1. A method of manufacturing an electronic component, comprising:
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forming a magnetic body in which internal coil parts are embedded; forming at least one laminate by stacking thermosetting resin layers on upper and lower portions of a magnetic metal plate to form each of the at least one laminate; stacking the at least one laminate on at least one of upper and lower portions of the magnetic body thereby forming a laminated magnetic body; and after forming the laminated magnetic body, compressing the laminated magnetic body to thereby puilverize the magnetic metal plate of the at least one laminate to have a plurality of metal fragments therein, thereby forming the at least one laminate having the pulverized metal plate stacked on the magnetic body into at least one cover part covering the magnetic body. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of manufacturing an electronic component, comprising:
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forming a magnetic body embedded with internal coil parts; and forming a cover part including a pulverized magnetic metal plate on at least one of upper and lower portions of the magnetic body, wherein the cover part further includes thermosetting resin layers surrounding the pulverized magnetic metal plate, the forming of the cover part including the pulverized magnetic metal plate comprises; stacking the thermosetting resin layers on opposite surfaces of a non-pulverized magnetic metal plate to form a laminate; pulverizing the non-pulverized magnetic metal plate into the plurality of metal fragments by compressing the laminate; and disposing the compressed laminate on at least one of upper and lower portions of the magnetic body to form the cover part, and the pulverizing of the non-pulverized magnetic metal plate comprises; forming the laminate on a support film and forming a cover film on the laminate; compressing the support film and the cover film against each other so as to pulverize the laminate interposed therebetween; and removing the support film and the cover film from the laminate. - View Dependent Claims (16, 17)
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Specification