Adaptive processes for improving integrity of surfaces
First Claim
1. A method for assembling a housing of an electronic device, the electronic device having a first component that includes a mating surface having a first surface portion and a second surface portion separated by a recess having a dimension within an acceptable tolerance range, the method comprising:
- measuring, relative to an internal reference datum, a first height of the first surface portion;
measuring, relative to the internal reference datum, a second height of the second surface portion;
when the second height is greater than the first height;
adding a printed material to the first surface portion to form a planarized mating surface such that (i) the first height is within a predetermined tolerance value of the second height, and (ii) the dimension of the recess remains generally unchanged;
placing an adhesive layer on the planarized mating surface; and
attaching a second component to the first component via the adhesive layer.
1 Assignment
0 Petitions
Accused Products
Abstract
A process for performing localized corrective actions to structure of an electronic device is described. The structure may include a mating surface configured to receive another structure such that the two structures may be, for example, adhesively bonded together. The localized corrective actions are configured not to improve the mating surface but to also prevent light within the electronic device from escaping in undesired areas of the electronic device. In some embodiments, the corrective action includes using a removal tool to remove identified portions of the surface. In other embodiments, the corrective action includes using a different tool to add material identified portions of the surface. The identified means may include an automated inspection system.
154 Citations
20 Claims
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1. A method for assembling a housing of an electronic device, the electronic device having a first component that includes a mating surface having a first surface portion and a second surface portion separated by a recess having a dimension within an acceptable tolerance range, the method comprising:
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measuring, relative to an internal reference datum, a first height of the first surface portion; measuring, relative to the internal reference datum, a second height of the second surface portion; when the second height is greater than the first height; adding a printed material to the first surface portion to form a planarized mating surface such that (i) the first height is within a predetermined tolerance value of the second height, and (ii) the dimension of the recess remains generally unchanged; placing an adhesive layer on the planarized mating surface; and attaching a second component to the first component via the adhesive layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A non-transitory computer-readable storage medium containing instructions that, when executed by one or more processors of a corrective system, cause the corrective system to assemble a housing for a portable electronic device that includes a mating surface that is defined by (i) a first component having a first surface portion, and (ii) a second component having a second surface portion:
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measure, relative to an internal reference datum, a first height of the first surface portion; measure, relative to the internal reference datum, a second height of the second surface portion; in response to determining that the second height is greater than the first height, wherein the first and second surface portions are separated by a recess having a dimension within an acceptable tolerance range; add a printed material to the first surface portion to form a planarized mating surface such that (i) the first height is within a predetermined tolerance value of the second height, and (ii) the dimension of the recess remains generally unchanged; apply an adhesive layer on the planarized mating surface; and attach the second component to the first component using the adhesive layer. - View Dependent Claims (13, 14, 15, 16)
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17. A system for providing corrective adjustment for a component of a housing for an electronic device, the component including (i) a first surface portion having a first height, and (ii) a second surface portion having a second height, the system comprising:
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an inspection system for determining that the component includes an uneven mating surface, wherein the second height is greater than the first height, and the first and second surface portions are separated by a recess having a dimension within an acceptable tolerance range; and a corrective system in communication with the inspection system, the corrective system configured to; add a printed material to the first surface portion to form a planarized mating surface while preventing the recess from receiving the printed material such that the first height is within a predetermined tolerance value of the second height, place an adhesive layer on the planarized mating surface, and attach an additional component to the component via the adhesive layer. - View Dependent Claims (18, 19, 20)
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Specification