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Adaptive processes for improving integrity of surfaces

  • US 10,162,343 B2
  • Filed: 07/23/2014
  • Issued: 12/25/2018
  • Est. Priority Date: 07/23/2014
  • Status: Active Grant
First Claim
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1. A method for assembling a housing of an electronic device, the electronic device having a first component that includes a mating surface having a first surface portion and a second surface portion separated by a recess having a dimension within an acceptable tolerance range, the method comprising:

  • measuring, relative to an internal reference datum, a first height of the first surface portion;

    measuring, relative to the internal reference datum, a second height of the second surface portion;

    when the second height is greater than the first height;

    adding a printed material to the first surface portion to form a planarized mating surface such that (i) the first height is within a predetermined tolerance value of the second height, and (ii) the dimension of the recess remains generally unchanged;

    placing an adhesive layer on the planarized mating surface; and

    attaching a second component to the first component via the adhesive layer.

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