Touch sensor assembly and method of manufacturing same

• US 10,180,748 B2
• Filed: 12/21/2015
• Issued: 01/15/2019
• Est. Priority Date: 12/24/2014
• Status: Active Grant

• Current Assignee: LG Electronics, Inc. (LG Corporation)
• Original Assignee: LG Electronics, Inc. (LG Corporation)
• Inventors: Kim, Hyunki, Park, Seungje
• Primary Examiner(s): Ketema, Benyam
• Application Number:
  US14/977,605
• Publication Number:
  US 20160188093A1
• Time in Patent Office: 1,121 Days
• Field of Search: 345173
• CPC Class Codes: F25D 2400/361 Interactive visual displays
• CPC Class Codes: F25D 29/005 Mounting of control devices
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/0414 using force sensing means to determine a position
• CPC Class Codes: G06F 3/0416 Control or interface arrangements specially adapted for digitisers
• CPC Class Codes: H03K 17/962 Capacitive touch switches
• CPC Class Codes: H03K 2217/960755 Constructional details of capacitive touch and proximity switches
• CPC Class Codes: H03K 2217/960785 with illumination

Abstract

A touch sensor assembly may include a sensor mounting portion formed at a insulating substrate, and a soldering spot provided at the sensor mounting portion, wherein a touch sensor is stably fixed to the sensor mounting portion by the soldering spot. In addition, the touch sensor assembly according to an embodiment of the present disclosure includes a copper coating film coated on a insulating substrate, and a top layer printed on the copper coating film, wherein the copper coating film is protected by the top layer.

Claims

1. A touch sensor assembly comprising:

an insulating substrate formed of a resin material;

a copper film defined as a conductive layer and provided over an upper surface of the insulating substrate to form a printed circuit;

a protective layer defined as a top layer and provided over an upper surface of the conductive layer;

a sensor mounting region formed by the upper surface of the conductive layer, which is exposed through the top layer, wherein a hole is formed at the sensor mounting region to form a sensor support;

at least one solder contact provided on an upper surface of the sensor mounting region;

a touch sensor including a metal plate, and a ceramic element installed on an upper surface of the metal plate, wherein a lower surface of the metal plate is attached to the upper surface of the sensor mounting region using the at least one solder contact;

a conductive foil covering the top layer and the touch sensor, and comprising a conductive line formed on a lower surface thereof, and

a cover film attached at a rear surface of the insulating substrate to shield the hole forming the sensor support,

wherein the conductive line includes;

an outer rode line having a diameter that corresponds to a diameter of the metal plate;

an inner guide formed within the outer guide line and having a diameter that corresponds to a diameter of the ceramic element;

a center conductive line which extends in a lengthwise direction at the center of the conductive foil and connects the inner guide line and the outer guide line; and

a circumferential conductive line formed in a grid shape and formed on an inner side of the inner guide line and an outer side of the outer guide line.

2. The touch sensor assembly of claim 1, further comprising a spacer provided between the top layer and the conductive foil.

3. The touch sensor assembly of claim 2, wherein the solder contact comprises a gel-typed solder cream.

4. The touch sensor assembly of claim 2, wherein the sensor support having a diameter smaller than a diameter of the metal plate and greater than a diameter of the ceramic element.

5. The touch sensor assembly of claim 4, wherein the spacer includes a sensor hole at a position where the touch sensor is attached, and the sensor hole has a diameter greater than the diameter of the metal plate.

6. The touch sensor assembly of claim 5, wherein an outer diameter of the sensor mounting region is formed to have a size correspond to a diameter of the sensor hole, and an inner diameter of the sensor mounting region is formed to have a size correspond to the diameter of the sensor support.

7. The touch sensor assembly of claim 3, wherein the at least one solder contact comprises a plurality of solder contacts.

8. The touch sensor assembly of claim 1, further comprising a sensor housing configured to accommodate the insulating substrate, wherein the sensor housing includes:

a housing body in which the insulating substrate is provided therein; and

a housing cover which is coupled with the housing body.

9. The touch sensor assembly of claim 8, further comprising an elastic member mounted on a lower surface of the insulating substrate, and providing a restoring force against a touch pressure transferred to the touch sensor.

10. The touch sensor assembly of claim 1, wherein the touch sensor includes a piezo sensor.