Peeling method and peeling apparatus
First Claim
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1. A peeling method comprising the steps of:
- a first step of forming a separation layer over a substrate;
a second step of forming a layer to be separated over the separation layer;
a third step of forming a peeling starting point by separating a part of the layer to be separated from the separation layer;
a fourth step of peeling the layer to be separated from the substrate using the peeling starting point; and
a liquid supplying step of supplying liquid to the peeling starting point,wherein the fourth step includes a step of heating a first portion of the substrate and a step of cooling a second portion of the layer to be separated,wherein the first portion includes a portion that is not separated from the layer to be separated after the fourth step, andwherein the second portion includes a portion separated from the substrate after the fourth step.
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Abstract
An object is to provide a novel peeling method and a novel peeling apparatus. A peeling method including a first step of forming a separation layer over a substrate, a second step of forming a layer to be separated over the separation layer, a third step of forming a peeling starting point by separating part of the layer to be separated from the separation layer, and a fourth step of peeling the layer to be separated from the substrate using the peeling starting point. In the fourth step, the substrate temperature is higher than or equal to 60 degrees Celsius and lower than or equal to 90 degrees Celsius.
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Citations
12 Claims
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1. A peeling method comprising the steps of:
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a first step of forming a separation layer over a substrate; a second step of forming a layer to be separated over the separation layer; a third step of forming a peeling starting point by separating a part of the layer to be separated from the separation layer; a fourth step of peeling the layer to be separated from the substrate using the peeling starting point; and a liquid supplying step of supplying liquid to the peeling starting point, wherein the fourth step includes a step of heating a first portion of the substrate and a step of cooling a second portion of the layer to be separated, wherein the first portion includes a portion that is not separated from the layer to be separated after the fourth step, and wherein the second portion includes a portion separated from the substrate after the fourth step. - View Dependent Claims (2, 3, 4, 5, 6, 7, 12)
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8. A peeling method comprising the steps of:
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a first step of forming a separation layer over a substrate; a second step of forming a layer to be separated over the separation layer; a third step of forming a peeling starting point by separating a part of the layer to be separated from the separation layer; and a fourth step of peeling the layer to be separated from the substrate using the peeling starting point, wherein in the fourth step, the layer to be separated is peeled from the substrate while at least a part of the layer to be separated is cooled and a part of the substrate is heated. - View Dependent Claims (9, 10, 11)
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Specification