Wire bond free wafer level LED
First Claim
1. A device comprising:
- a plurality of active regions, each of which is between an n-type layer and a p-type layer, wherein one of said n-type or p-type layers comprises the primary emission surface;
one or more n-electrodes and corresponding one or more vias;
one or more p-electrodes, wherein said n-electrodes and p-electrodes are in electrical contact with said active regions, and wherein said n-electrodes and p-electrodes are on the side of said active region opposite said primary emission surface;
one or more n-pads in electrical contact with corresponding said one or more n-electrodes; and
one or more spacer elements, wherein said one or more spacer elements is partially between said one or more n-pads and a portion of said one or more n-electrodes nearest said corresponding one or more n-pads.
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Accused Products
Abstract
A wire-bond free semiconductor device with two electrodes both of which are accessible from the bottom side of the device. The device is fabricated with two electrodes that are electrically connected to the oppositely doped epitaxial layers, each of these electrodes having leads with bottom-side access points. This structure allows the device to be biased with an external voltage/current source, obviating the need for wire-bonds or other such connection mechanisms that must be formed at the packaging level. Thus, features that are traditionally added to the device at the packaging level (e.g., phosphor layers or encapsulants) may be included in the wafer level fabrication process. Additionally, the bottom-side electrodes are thick enough to provide primary structural support to the device, eliminating the need to leave the growth substrate as part of the finished device.
122 Citations
20 Claims
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1. A device comprising:
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a plurality of active regions, each of which is between an n-type layer and a p-type layer, wherein one of said n-type or p-type layers comprises the primary emission surface; one or more n-electrodes and corresponding one or more vias; one or more p-electrodes, wherein said n-electrodes and p-electrodes are in electrical contact with said active regions, and wherein said n-electrodes and p-electrodes are on the side of said active region opposite said primary emission surface; one or more n-pads in electrical contact with corresponding said one or more n-electrodes; and one or more spacer elements, wherein said one or more spacer elements is partially between said one or more n-pads and a portion of said one or more n-electrodes nearest said corresponding one or more n-pads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 18, 19)
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11. A device comprising:
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a plurality of active regions each having a primary emission surface; multiple n-electrodes accessible from a surface opposite the primary emission surface and each providing an electrical path to one or more of said active regions; and multiple p-electrodes on the same side of said active regions as said n-electrodes, each of said p-electrodes also accessible from a surface opposite the primary emission surface and providing an electrical path to one or more of said active regions, wherein said n-electrodes and said p-electrodes have surfaces that are coplanar, wherein a cross-section of each of said n-electrodes widens toward said surface opposite the primary emission surface. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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20. A device comprising:
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a plurality of active regions each having a primary emission surface; multiple n-electrodes accessible from a surface opposite the primary emission surface and each providing an electrical path to one or more of said active regions; multiple p-electrodes on the same side of said active regions as said n-electrodes, each of said p-electrodes also accessible from a surface opposite the primary emission surface and providing an electrical path to one or more of said active regions, wherein said n-electrodes and said p-electrodes provide primary mechanical support for said device; multiple n-pads in electrical contact with corresponding said n-electrodes; and one or more spacer elements, wherein said one or more spacer elements is partially between said n-pads and a portion of said n-electrodes nearest said corresponding one or more n-pads.
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Specification