Light source device having light-emitting diode chips of varying thickness
First Claim
1. A light source device, comprising:
- a substrate having an upper surface;
at least one first light-emitting diode (LED) chip disposed on the upper surface and electrically connected to the substrate; and
at least one second LED chip disposed on the upper surface and electrically connected to the substrate, wherein a first distance from the upper surface to a top surface of the at least one first LED chip is higher than a second distance from the upper surface to a top surface of the at least one second LED chip, and a thickness of the at least one second LED chip is different from a thickness of the at least one first LED chip,wherein the at least one first LED chip comprises a first chip substrate, the at least one second LED chip comprises a second chip substrate, and a thickness of the second chip substrate is different from a thickness of the first chip substrate.
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Accused Products
Abstract
A light source device including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. Each of the first LED chips includes a first chip substrate, a first semiconductor layer, and a plurality of first electrodes, and the first electrodes are disposed on the upper surface of the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. The second LED chip includes a second chip substrate, a second semiconductor layer, and a plurality of second electrodes. A thickness of the second chip substrate is different from than a thickness of the first chip substrate, and the second electrodes are disposed on the upper surface of the substrate.
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Citations
5 Claims
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1. A light source device, comprising:
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a substrate having an upper surface; at least one first light-emitting diode (LED) chip disposed on the upper surface and electrically connected to the substrate; and at least one second LED chip disposed on the upper surface and electrically connected to the substrate, wherein a first distance from the upper surface to a top surface of the at least one first LED chip is higher than a second distance from the upper surface to a top surface of the at least one second LED chip, and a thickness of the at least one second LED chip is different from a thickness of the at least one first LED chip, wherein the at least one first LED chip comprises a first chip substrate, the at least one second LED chip comprises a second chip substrate, and a thickness of the second chip substrate is different from a thickness of the first chip substrate. - View Dependent Claims (2, 3, 4, 5)
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Specification