Systems and methods for sealing a plurality of reservoirs of a microchip element with a sealing grid

• US 10,427,153 B2
• Filed: 08/19/2016
• Issued: 10/01/2019
• Est. Priority Date: 08/25/2011
• Status: Active Grant

• Current Assignee: DARE MB Incorporated
• Original Assignee: Microchips Biotech, Inc. (Keratin Biosciences, Inc.)
• Inventors: Farra, Robert
• Primary Examiner(s): Schmidt, Emily L
• Application Number:
  US15/241,581
• Publication Number:
  US 20160354780A1
• Time in Patent Office: 1,138 Days
• CPC Class Codes: A61B 2562/12 Manufacturing methods specially adapted for producing sensors for in-vivo measurements
• CPC Class Codes: A61B 2562/168 Fluid filled sensor housings
• CPC Class Codes: A61B 5/076 Permanent implantations telemetry using implanted circuitry A61B5/0031; implanted stimulators for therapy A61N1/3605, A61N1/362, A61N1/372
• CPC Class Codes: A61B 5/4839 combined with drug delivery
• CPC Class Codes: A61B 5/6861 Capsules, e.g. for swallowing or implanting
• CPC Class Codes: A61K 9/0097 Micromachined devices; Microelectromechanical systems [MEMS]; Devices obtained by lithographic treatment of silicon; Devices comprising chips intradermal microneedle arrays A61K9/0021; MEMS in general B81B7/02
• CPC Class Codes: A61M 2205/0244 Micromachined materials, e.g. made from silicon wafers, microelectromechanical systems [MEMS] or comprising nanotechnology
• CPC Class Codes: A61M 2207/00 Methods of manufacture, assembly or production
• CPC Class Codes: A61M 31/002 Devices for releasing a drug at a continuous and controlled rate for a prolonged period of time artificial gland structures or devices A61F2/022; intra-uterine contraceptive devices A61F6/14; tampons for introducing into the vagina A61F13/20, A61L15/00; suppositories or bougies for intra-vaginal or intra-uterine application A61K9/02; physical forms of medicinal preparations for sustained or differential drug release A61K9/20, A61K9/50
• CPC Class Codes: B01L 2200/0689 Sealing
• CPC Class Codes: B01L 2200/12 Specific details about manufacturing devices
• CPC Class Codes: B01L 2300/042 Caps; Plugs
• CPC Class Codes: B01L 2300/0819 Microarrays; Biochips
• CPC Class Codes: B01L 2300/0848 Specific forms of parts of containers
• CPC Class Codes: B01L 2300/0858 Side walls
• CPC Class Codes: B01L 2300/12 Specific details about materials
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: B01L 3/502715 characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces
• CPC Class Codes: B23K 20/00 Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
• CPC Class Codes: Y10T 29/49126 Assembling bases

Abstract

Systems and methods for sealing a plurality of reservoirs of a microchip element with a sealing grid are provided. For example, in one embodiment, a microchip element comprises a primary substrate having a plurality of reservoirs defined therein. The microchip element also includes a single continuous sealing groove defined in the primary substrate that extends around each of the plurality of reservoirs. In addition, the microchip element includes a sealing substrate comprising a single continuous sealing protrusion extending therefrom. The single continuous sealing protrusion corresponds to and is configured to mate with the single continuous sealing groove to form a hermetic bond between the primary substrate and the sealing substrate. In this manner, the single continuous sealing groove and the single continuous sealing protrusion form a sealing grid about the plurality of reservoirs.

Claims

1. A microchip element, comprising:

a primary substrate comprising a plurality of reservoirs defined therein;

a single continuous sealing groove defined in the primary substrate and extending between and shared by all of the plurality of reservoirs; and

a sealing substrate comprising a single continuous sealing protrusion extending therefrom,

wherein the single continuous sealing protrusion corresponds to and is configured to mate with the single continuous sealing groove to form a hermetic bond between the primary substrate and the sealing substrate,

wherein the single continuous groove and the single continuous sealing protrusion extend around and are shared by each of the plurality of reservoirs, such that each reservoir does not have its own independent sealing ring,

wherein each of the plurality of reservoirs is defined by a closed end wall, an open end, and at least one sidewall extending between the closed end wall and the open end, and

wherein the sealing substrate comprises a first side, an opposed second side, and a plurality of apertures extending therethrough, wherein the first side comprises a plurality of electrically conductive reservoir caps which close off the plurality of apertures.

2. The microchip element of claim 1, wherein the single continuous sealing protrusion is disposed on the second side of the sealing substrate, and wherein the second side of the sealing substrate is hermetically bonded to the primary substrate, such that the open end of the plurality of reservoirs is in fluid communication with at least one aperture of the plurality of apertures.

3. The microchip element of claim 1, wherein the sealing substrate comprises a silicon substrate.

4. The microchip element of claim 1, wherein the primary substrate comprises a polymer or a glass or other ceramic material.

5. The microchip element of claim 4, wherein the primary substrate comprises a metal coating over at least a part of the polymer, glass or other ceramic material of the primary substrate.

6. The microchip element of claim 5, wherein the metal coating coats the at least one sidewall and/or the closed end wall of each of the plurality of reservoirs.

7. The microchip element of claim 1, further comprising reservoir contents positioned within at least one reservoir of the plurality of reservoirs.

8. The microchip element of claim 1, wherein the single continuous sealing protrusion comprises gold.

9. The microchip element of claim 1, wherein the single continuous sealing groove comprises gold.

10. The microchip element of claim 1, wherein the closed end wall and the at least one sidewall are part of the same monolithic structure.

11. The microchip element of claim 1, wherein the plurality of reservoirs comprise a drug payload.

15. The microchip element of claim 1, wherein the closed end wall and the at least one sidewall are part of the same monolithic structure.

12. A microchip element, comprising:

a sealing substrate;

a primary substrate;

a plurality of reservoirs defined within the primary substrate and/or within the sealing substrate;

a sealing grid comprising a single continuous sealing groove and a single continuous sealing protrusion, wherein the single continuous groove and the single continuous sealing protrusion extend around and are shared by each of the plurality of reservoirs; and

wherein the single continuous sealing protrusion corresponds to and is configured to mate with the single continuous sealing groove to form a hermetic bond between the primary substrate and the sealing substrate,

wherein each reservoir does not have its own independent sealing ring,

wherein each of the plurality of reservoirs is defined by a closed end wall, an open end, and at least one sidewall extending between the closed end wall and the open end, and

wherein the sealing substrate comprises a first side, an opposed second side, and a plurality of apertures extending therethrough, wherein the first side comprises a plurality of electrically conductive reservoir caps which close off the plurality of apertures.

13. The microchip element of claim 12, wherein the single continuous sealing protrusion is disposed on the second side of the sealing substrate, and wherein the second side of the sealing substrate is hermetically bonded to the primary substrate, such that the open end of the plurality of reservoirs is in fluid communication with at least one aperture of the plurality of apertures.

14. The microchip element of claim 12, further comprising reservoir contents positioned within at least one reservoir of the plurality of reservoirs.

16. The microchip element of claim 12, wherein the single continuous groove and the single continuous sealing protrusion form interconnected squares with rounded corners, each square being around one of the reservoirs.

17. The microchip element of claim 12, wherein the plurality of reservoirs comprise a drug payload.

18. The microchip element of claim 12, wherein the at least one sidewall of each reservoir has a height which is defined more than 50% by the primary substrate.

19. The microchip element of claim 12, wherein the plurality of reservoirs are microreservoirs.

20. An implantable medical device comprising:

an array of hermetically sealed reservoirs defined by two substrate portions which are bonded together by a single continuous protrusion mated with a single continuous groove, which surrounds each of the hermetically sealed reservoirs,

wherein the mated single protrusion and single groove extend around and are shared by each of the hermetically sealed reservoirs, and each of the hermetically sealed reservoirs does not have its own independent sealing ring,

wherein each of the hermetically sealed reservoirs is defined by a closed end wall, an open end, and at least one sidewall extending between the closed end wall and the open end, and

wherein a sealing substrate of the two substrate portions comprises a first side, an opposed second side, and a plurality of apertures extending therethrough, wherein the first side comprises a plurality of electrically conductive reservoir cap which close off the plurality of apertures.

21. The device of claim 20, wherein the hermetically sealed reservoirs comprise a drug or a biosensor.