Systems and methods for sealing a plurality of reservoirs of a microchip element with a sealing grid
First Claim
1. A microchip element, comprising:
- a primary substrate comprising a plurality of reservoirs defined therein;
a single continuous sealing groove defined in the primary substrate and extending between and shared by all of the plurality of reservoirs; and
a sealing substrate comprising a single continuous sealing protrusion extending therefrom,wherein the single continuous sealing protrusion corresponds to and is configured to mate with the single continuous sealing groove to form a hermetic bond between the primary substrate and the sealing substrate,wherein the single continuous groove and the single continuous sealing protrusion extend around and are shared by each of the plurality of reservoirs, such that each reservoir does not have its own independent sealing ring,wherein each of the plurality of reservoirs is defined by a closed end wall, an open end, and at least one sidewall extending between the closed end wall and the open end, andwherein the sealing substrate comprises a first side, an opposed second side, and a plurality of apertures extending therethrough, wherein the first side comprises a plurality of electrically conductive reservoir caps which close off the plurality of apertures.
2 Assignments
0 Petitions
Accused Products
Abstract
Systems and methods for sealing a plurality of reservoirs of a microchip element with a sealing grid are provided. For example, in one embodiment, a microchip element comprises a primary substrate having a plurality of reservoirs defined therein. The microchip element also includes a single continuous sealing groove defined in the primary substrate that extends around each of the plurality of reservoirs. In addition, the microchip element includes a sealing substrate comprising a single continuous sealing protrusion extending therefrom. The single continuous sealing protrusion corresponds to and is configured to mate with the single continuous sealing groove to form a hermetic bond between the primary substrate and the sealing substrate. In this manner, the single continuous sealing groove and the single continuous sealing protrusion form a sealing grid about the plurality of reservoirs.
-
Citations
21 Claims
-
1. A microchip element, comprising:
-
a primary substrate comprising a plurality of reservoirs defined therein; a single continuous sealing groove defined in the primary substrate and extending between and shared by all of the plurality of reservoirs; and a sealing substrate comprising a single continuous sealing protrusion extending therefrom, wherein the single continuous sealing protrusion corresponds to and is configured to mate with the single continuous sealing groove to form a hermetic bond between the primary substrate and the sealing substrate, wherein the single continuous groove and the single continuous sealing protrusion extend around and are shared by each of the plurality of reservoirs, such that each reservoir does not have its own independent sealing ring, wherein each of the plurality of reservoirs is defined by a closed end wall, an open end, and at least one sidewall extending between the closed end wall and the open end, and wherein the sealing substrate comprises a first side, an opposed second side, and a plurality of apertures extending therethrough, wherein the first side comprises a plurality of electrically conductive reservoir caps which close off the plurality of apertures. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 15)
-
-
12. A microchip element, comprising:
-
a sealing substrate; a primary substrate; a plurality of reservoirs defined within the primary substrate and/or within the sealing substrate; a sealing grid comprising a single continuous sealing groove and a single continuous sealing protrusion, wherein the single continuous groove and the single continuous sealing protrusion extend around and are shared by each of the plurality of reservoirs; and wherein the single continuous sealing protrusion corresponds to and is configured to mate with the single continuous sealing groove to form a hermetic bond between the primary substrate and the sealing substrate, wherein each reservoir does not have its own independent sealing ring, wherein each of the plurality of reservoirs is defined by a closed end wall, an open end, and at least one sidewall extending between the closed end wall and the open end, and wherein the sealing substrate comprises a first side, an opposed second side, and a plurality of apertures extending therethrough, wherein the first side comprises a plurality of electrically conductive reservoir caps which close off the plurality of apertures. - View Dependent Claims (13, 14, 16, 17, 18, 19)
-
-
20. An implantable medical device comprising:
-
an array of hermetically sealed reservoirs defined by two substrate portions which are bonded together by a single continuous protrusion mated with a single continuous groove, which surrounds each of the hermetically sealed reservoirs, wherein the mated single protrusion and single groove extend around and are shared by each of the hermetically sealed reservoirs, and each of the hermetically sealed reservoirs does not have its own independent sealing ring, wherein each of the hermetically sealed reservoirs is defined by a closed end wall, an open end, and at least one sidewall extending between the closed end wall and the open end, and wherein a sealing substrate of the two substrate portions comprises a first side, an opposed second side, and a plurality of apertures extending therethrough, wherein the first side comprises a plurality of electrically conductive reservoir cap which close off the plurality of apertures. - View Dependent Claims (21)
-
Specification