Antenna module and circuit module
First Claim
1. An antenna module comprising:
- a dielectric substrate in which an antenna being disposed, the antenna comprising a conductor pattern;
a high-frequency semiconductor device that is mounted on a bottom surface of the dielectric substrate and that supplies a high-frequency signal to the antenna;
a plurality of conductor columns that projects from the bottom surface; and
a dielectric member that is disposed on the bottom surface and in which the conductor columns are embedded such that an end of each of the conductor columns projects out from the dielectric member,wherein the dielectric member defines a mounting surface that faces a mounting substrate, andwherein a step is formed in a side surface of a composite structure that includes the dielectric substrate and the dielectric member, said step being formed between an outer periphery of the dielectric substrate and an outer periphery of the dielectric member, and a part of the side surface extending from the mounting surface to the step is more recessed than other part of the side surface that is located above the step.
1 Assignment
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Accused Products
Abstract
An antenna that is formed of a conductor pattern is disposed on a dielectric substrate. A high-frequency semiconductor device that supplies a high-frequency signal to the antenna is mounted on the bottom surface of the dielectric substrate. A plurality of conductor columns project from the bottom surface. The conductor columns are embedded in a dielectric member that is disposed on the bottom surface. An end of each of the conductor columns is exposed through the dielectric member. The dielectric member defines a mounting surface that faces a mounting substrate. A step is formed in a side surface of a composite structure that includes the dielectric substrate and the dielectric member, and a side surface extending from the mounting surface to the step is more recessed than a side surface that is located above the step.
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Citations
13 Claims
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1. An antenna module comprising:
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a dielectric substrate in which an antenna being disposed, the antenna comprising a conductor pattern; a high-frequency semiconductor device that is mounted on a bottom surface of the dielectric substrate and that supplies a high-frequency signal to the antenna; a plurality of conductor columns that projects from the bottom surface; and a dielectric member that is disposed on the bottom surface and in which the conductor columns are embedded such that an end of each of the conductor columns projects out from the dielectric member, wherein the dielectric member defines a mounting surface that faces a mounting substrate, and wherein a step is formed in a side surface of a composite structure that includes the dielectric substrate and the dielectric member, said step being formed between an outer periphery of the dielectric substrate and an outer periphery of the dielectric member, and a part of the side surface extending from the mounting surface to the step is more recessed than other part of the side surface that is located above the step. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A circuit module comprising:
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a dielectric substrate on which a conductor pattern is provided; a first semiconductor device that is mounted on a bottom surface of the dielectric substrate and connected to the conductor pattern; a plurality of conductor columns that projects from the bottom surface; and a dielectric member that is disposed on the bottom surface and in which the conductor columns are embedded such that an end of each of the conductor columns projects out from the dielectric member, wherein the dielectric member defines a mounting surface that faces a mounting substrate, and wherein a step is formed in a side surface of a composite structure that includes the dielectric substrate and the dielectric member, said step being formed between an outer periphery of the dielectric substrate and an outer periphery of the dielectric member, and a portion of the side surface extending from the mounting surface to the step is more recessed than other portion of the side surface that is located above the step. - View Dependent Claims (9, 10, 11, 12, 13)
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Specification