Thermoelectric cooler (TEC) for spot cooling of 2.5D/3D IC packages

• US 10,504,816 B2
• Filed: 09/06/2017
• Issued: 12/10/2019
• Est. Priority Date: 09/06/2017
• Status: Active Grant

• Current Assignee: Google LLC (Alphabet Inc.)
• Original Assignee: Google LLC (Alphabet Inc.)
• Inventors: Beauchemin, Melanie, Iyengar, Madhusudan, Malone, Christopher, Imwalle, Gregory
• Primary Examiner(s): Trinh, Hoa B
• Application Number:
  US15/696,962
• Publication Number:
  US 20190074237A1
• Time in Patent Office: 825 Days
• CPC Class Codes: F25B 21/02 using Peltier effect; using Nernst-Ettinghausen effect
• CPC Class Codes: F25B 2321/023 Mounting details thereof
• CPC Class Codes: F25B 2321/0251 by a gas
• CPC Class Codes: H01L 21/4882 Assembly of heatsink parts
• CPC Class Codes: H01L 21/52 Mounting semiconductor bodies in containers
• CPC Class Codes: H01L 23/053 the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/38 Cooling arrangements using the Peltier effect
• CPC Class Codes: H01L 23/433 Auxiliary members in containers characterised by their shape, e.g. pistons
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/1433 Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/1434 Memory

Abstract

While the use of 2.5D/3D packaging technology results in a compact IC package, it also raises challenges with respect to thermal management. Integrated component packages according to the present disclosure provide a thermal management solution for 2.5D/3D IC packages that include a high-power component integrated with multiple lower-power components. The thermal solution provided by the present disclosure includes a mix of passive cooling by traditional heatsink or cold plate and active cooling by thermoelectric cooling (TEC) elements. Certain methods according to the present disclosure include controlling a temperature during normal operation in an IC package that includes a plurality of lower-power components located adjacent to a high-power component in which the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation.

Claims

1. An integrated component package comprising:

a plurality of lower-power components and a high-power component coupled to a surface of a package substrate, wherein the lower-power components are located adjacent to the high-power component, each of the plurality of lower-power components and the high-power component generates heat during normal operation and the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation;

a package lid that is coupled to the package substrate and covers the plurality of lower-power components and the high-power component;

a cold plate physically and thermally coupled to the package lid, the cold plate including a base surface and a top surface, wherein the top surface is opposite the base surface relative to the package lid; and

a plurality of thermoelectric cooling (TEC) elements, each TEC element having a footprint representing an outline of the TEC element in a plane parallel to the surface of the package substrate, wherein the TEC elements are sized and positioned within the integrated component package with at least a substantial portion of the footprints of the respective TEC elements projected in a direction normal to the plane overlapping with at least one of the lower-power components, and substantially no portions of the footprints of the TEC elements projected in the direction normal to the plane substantially overlapping the high-power component,

wherein the integrated component package includes one configuration from a list of configurations comprising;

1) wherein the TECs are integrated into the package lid such that a first side of each TEC is embedded in the package lid and a second side of each TEC is physically and thermally coupled to the base surface of the cold plate;

2) wherein the TECs are integrated into the package lid such that a first side of each TEC is embedded the package lid and a second side of each TEC is physically and thermally coupled to the lower power components;

3) wherein the TECs are integrated into the package lid such that a first side of each TEC is coupled, and thermally coupled to the base surface of the cold plate and a second side of each TEC is physically and thermally coupled to the lower power components, or

4) wherein a first side of each TEC is embedded in the package substrate and a second side of each TEC is physically and thermally coupled to the low power components.

4. The package of claim 1, wherein the TECs are integrated into the package lid such that the first side of each TEC is embedded in the package lid and the second side of each TEC is physically and thermally coupled to the base surface of the cold plate.

5. The package of claim 1, wherein the TECs are integrated into the package lid such that the first side of each TEC is embedded the package lid and the second side of each TEC is physically and thermally coupled to the lower power components.

6. The package of claim 1, wherein the TECs are integrated into the package lid such that the first side of each TEC is coupled, and thermally coupled to the base surface of the cold plate and the second side of each TEC is physically and thermally coupled to the lower power components.

7. The package of claim 1, wherein the first side of each TEC is embedded in the package substrate and the second side of each TEC is physically and thermally coupled to the low power components.

8. The package of claim 1, wherein each TEC is independently powered.

2. An integrated component package comprising:

a plurality of lower-power components and a high-power component coupled to a surface of a package substrate, wherein the lower-power components are located adjacent to the high-power component, each of the plurality of lower-power components and the high-power component generates heat during normal operation and the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation;

a package lid that is coupled to the package substrate and covers the plurality of lower-power components and the high-power component;

a cold plate physically and thermally coupled to the package lid, the cold plate including a base surface and a top surface, wherein the top surface is opposite the base surface relative to the package lid; and

a plurality of thermoelectric cooling (TEC) elements, each TEC element having a footprint representing an outline of the TEC element in a plane parallel to the surface of the package substrate, wherein the TEC elements are sized and positioned within the integrated component package with at least a substantial portion of the footprints of the respective TEC elements projected in a direction normal to the plane overlapping with at least one of the lower-power components, and substantially no portions of the footprints of the TEC elements projected in the direction normal to the plane substantially overlapping the high-power component,

wherein the TECs are integrated into the cold plate such that a first side of each TEC is embedded in the base surface of the cold plate and a second side of each TEC is physically and thermally coupled to the package lid.

3. The package of claim 2, wherein the base surface of the cold plate includes a plurality of insulating notches, each notch positioned adjacent to one of the plurality of TECs.

15. The package of claim 2, wherein each TEC is independently powered.

9. A method of assembling an integrated component package, the method comprising:

coupling a plurality of lower-power components and a high-power component to a surface of a package substrate, wherein the lower-power components are located adjacent to the high-power component, each of the plurality of lower-power components and the high-power component generates heat during normal operation and the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation;

coupling a package lid to the package substrate, wherein the package lid covers the plurality of lower-power components and the high-power component;

physically and thermally coupling a cold plate to the package lid, the cold plate including a base surface and a top surface, wherein the top surface is opposite the base surface relative to the package lid;

sizing and positioning a plurality of thermoelectric cooling (TEC) elements, each TEC element having a footprint representing an outline of the TEC element in a plane parallel to the surface of the package substrate, within the integrated component package with at least a substantial portion of the footprints of the respective TEC elements projected in a direction normal to the plane overlapping with at least one of the lower-power components, and substantially none of the footprints of the TEC elements projected in the direction normal to the plane substantially overlapping the high-power component; and

one of;

1) integrating the TECs into the package lid such that a first side of each TEC is embedded in the package lid and a second side of each TEC is physically and thermally coupled to the base surface of the cold plate;

2) integrating the TECs into the package lid such that a first side of each TEC is embedded the package lid and a second side of each TEC is physically and thermally coupled to the lower power components;

3) integrating the TECs into the package lid such that a first side of each TEC is coupled, and thermally coupled to the base surface of the cold plate and a second side of each TEC is physically and thermally coupled to the lower power components;

or

4) integrating the TECs into the package lid such that a first side of each TEC is embedded in the package substrate and a second side of each TEC is physically and thermally coupled to the low power components.

12. The method of claim 9, further comprising integrating the TECs into the package lid such that the first side of each TEC is embedded in the package lid and the second side of each TEC is physically and thermally coupled to the base surface of the cold plate.

13. The method of claim 9, further comprising integrating the TECs into the package lid such that the first side of each TEC is embedded the package lid and the second side of each TEC is physically and thermally coupled to the lower power components.

14. The method of claim 9, further comprising integrating the TECs into the package lid such that the first side of each TEC is coupled, and thermally coupled to the base surface of the cold plate and the second side of each TEC is physically and thermally coupled to the lower power components.

16. The method of claim 9, further comprising independently powering each TEC.

17. The method of claim 9, further comprising integrating the TECs into the package lid such that the first side of each TEC is embedded in the package substrate and the second side of each TEC is physically and thermally coupled to the low power components.

10. A method of assembling an integrated component package, the method comprising:

coupling a plurality of lower-power components and a high-power component to a surface of a package substrate, wherein the lower-power components are located adjacent to the high-power component, each of the plurality of lower-power components and the high-power component generates heat during normal operation and the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation;

coupling a package lid to the package substrate, wherein the package lid covers the plurality of lower-power components and the high-power component;

physically and thermally coupling a cold plate to the package lid, the cold plate including a base surface and a top surface, wherein the top surface is opposite the base surface relative to the package lid;

sizing and positioning a plurality of thermoelectric cooling (TEC) elements, each TEC element having a footprint representing an outline of the TEC element in a plane parallel to the surface of the package substrate, within the integrated component package with at least a substantial portion of the footprints of the respective TEC elements projected in a direction normal to the plane overlapping with at least one of the lower-power components, and substantially none of the footprints of the TEC elements projected in the direction normal to the plane substantially overlapping the high-power component; and

integrating the TECs into the cold plate such that a first side of each TEC is embedded in the base surface of the cold plate and a second side of each TEC is physically and thermally coupled to the package lid.

11. The method of claim 10, further comprising including a plurality of insulating notches in the base surface of the cold plate such that each notch is positioned adjacent to one of the plurality of TECs.

18. The method of claim 10, further comprising independently powering each TEC.