Thermoelectric cooler (TEC) for spot cooling of 2.5D/3D IC packages
First Claim
1. An integrated component package comprising:
- a plurality of lower-power components and a high-power component coupled to a surface of a package substrate, wherein the lower-power components are located adjacent to the high-power component, each of the plurality of lower-power components and the high-power component generates heat during normal operation and the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation;
a package lid that is coupled to the package substrate and covers the plurality of lower-power components and the high-power component;
a cold plate physically and thermally coupled to the package lid, the cold plate including a base surface and a top surface, wherein the top surface is opposite the base surface relative to the package lid; and
a plurality of thermoelectric cooling (TEC) elements, each TEC element having a footprint representing an outline of the TEC element in a plane parallel to the surface of the package substrate, wherein the TEC elements are sized and positioned within the integrated component package with at least a substantial portion of the footprints of the respective TEC elements projected in a direction normal to the plane overlapping with at least one of the lower-power components, and substantially no portions of the footprints of the TEC elements projected in the direction normal to the plane substantially overlapping the high-power component,wherein the integrated component package includes one configuration from a list of configurations comprising;
1) wherein the TECs are integrated into the package lid such that a first side of each TEC is embedded in the package lid and a second side of each TEC is physically and thermally coupled to the base surface of the cold plate;
2) wherein the TECs are integrated into the package lid such that a first side of each TEC is embedded the package lid and a second side of each TEC is physically and thermally coupled to the lower power components;
3) wherein the TECs are integrated into the package lid such that a first side of each TEC is coupled, and thermally coupled to the base surface of the cold plate and a second side of each TEC is physically and thermally coupled to the lower power components, or4) wherein a first side of each TEC is embedded in the package substrate and a second side of each TEC is physically and thermally coupled to the low power components.
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Accused Products
Abstract
While the use of 2.5D/3D packaging technology results in a compact IC package, it also raises challenges with respect to thermal management. Integrated component packages according to the present disclosure provide a thermal management solution for 2.5D/3D IC packages that include a high-power component integrated with multiple lower-power components. The thermal solution provided by the present disclosure includes a mix of passive cooling by traditional heatsink or cold plate and active cooling by thermoelectric cooling (TEC) elements. Certain methods according to the present disclosure include controlling a temperature during normal operation in an IC package that includes a plurality of lower-power components located adjacent to a high-power component in which the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation.
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Citations
18 Claims
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1. An integrated component package comprising:
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a plurality of lower-power components and a high-power component coupled to a surface of a package substrate, wherein the lower-power components are located adjacent to the high-power component, each of the plurality of lower-power components and the high-power component generates heat during normal operation and the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation; a package lid that is coupled to the package substrate and covers the plurality of lower-power components and the high-power component; a cold plate physically and thermally coupled to the package lid, the cold plate including a base surface and a top surface, wherein the top surface is opposite the base surface relative to the package lid; and a plurality of thermoelectric cooling (TEC) elements, each TEC element having a footprint representing an outline of the TEC element in a plane parallel to the surface of the package substrate, wherein the TEC elements are sized and positioned within the integrated component package with at least a substantial portion of the footprints of the respective TEC elements projected in a direction normal to the plane overlapping with at least one of the lower-power components, and substantially no portions of the footprints of the TEC elements projected in the direction normal to the plane substantially overlapping the high-power component, wherein the integrated component package includes one configuration from a list of configurations comprising; 1) wherein the TECs are integrated into the package lid such that a first side of each TEC is embedded in the package lid and a second side of each TEC is physically and thermally coupled to the base surface of the cold plate; 2) wherein the TECs are integrated into the package lid such that a first side of each TEC is embedded the package lid and a second side of each TEC is physically and thermally coupled to the lower power components; 3) wherein the TECs are integrated into the package lid such that a first side of each TEC is coupled, and thermally coupled to the base surface of the cold plate and a second side of each TEC is physically and thermally coupled to the lower power components, or 4) wherein a first side of each TEC is embedded in the package substrate and a second side of each TEC is physically and thermally coupled to the low power components. - View Dependent Claims (4, 5, 6, 7, 8)
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2. An integrated component package comprising:
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a plurality of lower-power components and a high-power component coupled to a surface of a package substrate, wherein the lower-power components are located adjacent to the high-power component, each of the plurality of lower-power components and the high-power component generates heat during normal operation and the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation; a package lid that is coupled to the package substrate and covers the plurality of lower-power components and the high-power component; a cold plate physically and thermally coupled to the package lid, the cold plate including a base surface and a top surface, wherein the top surface is opposite the base surface relative to the package lid; and a plurality of thermoelectric cooling (TEC) elements, each TEC element having a footprint representing an outline of the TEC element in a plane parallel to the surface of the package substrate, wherein the TEC elements are sized and positioned within the integrated component package with at least a substantial portion of the footprints of the respective TEC elements projected in a direction normal to the plane overlapping with at least one of the lower-power components, and substantially no portions of the footprints of the TEC elements projected in the direction normal to the plane substantially overlapping the high-power component, wherein the TECs are integrated into the cold plate such that a first side of each TEC is embedded in the base surface of the cold plate and a second side of each TEC is physically and thermally coupled to the package lid. - View Dependent Claims (3, 15)
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9. A method of assembling an integrated component package, the method comprising:
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coupling a plurality of lower-power components and a high-power component to a surface of a package substrate, wherein the lower-power components are located adjacent to the high-power component, each of the plurality of lower-power components and the high-power component generates heat during normal operation and the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation; coupling a package lid to the package substrate, wherein the package lid covers the plurality of lower-power components and the high-power component; physically and thermally coupling a cold plate to the package lid, the cold plate including a base surface and a top surface, wherein the top surface is opposite the base surface relative to the package lid; sizing and positioning a plurality of thermoelectric cooling (TEC) elements, each TEC element having a footprint representing an outline of the TEC element in a plane parallel to the surface of the package substrate, within the integrated component package with at least a substantial portion of the footprints of the respective TEC elements projected in a direction normal to the plane overlapping with at least one of the lower-power components, and substantially none of the footprints of the TEC elements projected in the direction normal to the plane substantially overlapping the high-power component; and one of; 1) integrating the TECs into the package lid such that a first side of each TEC is embedded in the package lid and a second side of each TEC is physically and thermally coupled to the base surface of the cold plate; 2) integrating the TECs into the package lid such that a first side of each TEC is embedded the package lid and a second side of each TEC is physically and thermally coupled to the lower power components; 3) integrating the TECs into the package lid such that a first side of each TEC is coupled, and thermally coupled to the base surface of the cold plate and a second side of each TEC is physically and thermally coupled to the lower power components;
or4) integrating the TECs into the package lid such that a first side of each TEC is embedded in the package substrate and a second side of each TEC is physically and thermally coupled to the low power components. - View Dependent Claims (12, 13, 14, 16, 17)
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10. A method of assembling an integrated component package, the method comprising:
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coupling a plurality of lower-power components and a high-power component to a surface of a package substrate, wherein the lower-power components are located adjacent to the high-power component, each of the plurality of lower-power components and the high-power component generates heat during normal operation and the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation; coupling a package lid to the package substrate, wherein the package lid covers the plurality of lower-power components and the high-power component; physically and thermally coupling a cold plate to the package lid, the cold plate including a base surface and a top surface, wherein the top surface is opposite the base surface relative to the package lid; sizing and positioning a plurality of thermoelectric cooling (TEC) elements, each TEC element having a footprint representing an outline of the TEC element in a plane parallel to the surface of the package substrate, within the integrated component package with at least a substantial portion of the footprints of the respective TEC elements projected in a direction normal to the plane overlapping with at least one of the lower-power components, and substantially none of the footprints of the TEC elements projected in the direction normal to the plane substantially overlapping the high-power component; and integrating the TECs into the cold plate such that a first side of each TEC is embedded in the base surface of the cold plate and a second side of each TEC is physically and thermally coupled to the package lid. - View Dependent Claims (11, 18)
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Specification