Coating method utilizing phosphor containment structure and devices fabricated using same
First Claim
1. A wafer, comprising:
- a plurality of light-emitting diodes (LEDs), each comprising sidewalls;
a contact on a first area of a surface of each LED in said plurality of LEDs;
a mask layer on said sidewalls and over at least a portion of said LEDs;
first and second openings in said mask layer over said first area and a second area on said surface of said LED, respectively;
wherein a portion of said mask layer comprises a plurality of containment structures, each containment structure comprising a rigid material and coupled to a respective one of said LEDs, wherein each containment structure defines said second area on said surface of each said respective LED, said second area differing from said first area, wherein said containment structure defines the borders of said second opening in said mask layer over said second area;
a phosphor material coating at least partially contained within each of said containment structures over each said second area on said surface of each said respective LED, wherein said phosphor material coating is excluded from substantially all of said first area and said contact; and
a dome shaped binder material, different from the material of said phosphor material coating, and having sidewalls substantially aligned with outer sidewalls of said containment structure.
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Accused Products
Abstract
Methods for fabricating a semiconductor devices, and in particular light emitting diodes (LEDS) comprising providing a plurality of semiconductor devices on a substrate and forming a contact on at least some of the semiconductor devices. A containment structure is formed on at least some of the semiconductor devices having a contact with each containment structure defining a deposition area excluding the contact. A coating material is deposited then within the deposition area, with the coating material not covering the contact. A light emitting diode (LED) chip wafer comprising a plurality of LEDs on a substrate wafer with at least some of the LEDs having a contact. A plurality of containment structures are included, each of which is associated with a respective one of the plurality of LEDs. Each of the containment structures at least partially on its respective one of the LEDs and defining a deposition area on its respective one of the LEDs. The deposition area excludes the contact. A coating is included in each of the deposition areas.
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Citations
37 Claims
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1. A wafer, comprising:
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a plurality of light-emitting diodes (LEDs), each comprising sidewalls; a contact on a first area of a surface of each LED in said plurality of LEDs; a mask layer on said sidewalls and over at least a portion of said LEDs; first and second openings in said mask layer over said first area and a second area on said surface of said LED, respectively; wherein a portion of said mask layer comprises a plurality of containment structures, each containment structure comprising a rigid material and coupled to a respective one of said LEDs, wherein each containment structure defines said second area on said surface of each said respective LED, said second area differing from said first area, wherein said containment structure defines the borders of said second opening in said mask layer over said second area; a phosphor material coating at least partially contained within each of said containment structures over each said second area on said surface of each said respective LED, wherein said phosphor material coating is excluded from substantially all of said first area and said contact; and a dome shaped binder material, different from the material of said phosphor material coating, and having sidewalls substantially aligned with outer sidewalls of said containment structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. A light emitting diode (LED) chip, comprising:
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an LED comprising sidewalls; a contact on a first area of a surface of said LED; a mask layer on said sidewalls and over at least a portion of said LED; first and second openings in said mask layer over said first area and a second area on said surface of said LED, respectively; wherein a portion of said mask layer comprises a containment structure, said containment structure comprising a rigid material and coupled to said LED, said containment structure defining said second area differing from said first area on said surface of said LED, wherein said containment structure defines the borders of said second opening in said mask layer over said second area; a phosphor material coating at least partially contained within said containment structure and over said second area on the surface of said LED, wherein said phosphor material coating is excluded from substantially all of said first area and said contact; and a dome shaped binder material, different from the material of said phosphor material coating, and having sidewalls substantially aligned with outer sidewalls of said containment structure. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36, 37)
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Specification