Lift off process for chip scale package solid state devices on engineered substrate
First Claim
1. A method of processing an engineered substrate structure, the method comprising:
- providing an engineered substrate structure including;
a polycrystalline substrate; and
an engineered layer encapsulating the polycrystalline substrate;
forming a sacrificial layer coupled to the engineered layer;
forming a solid state device structure coupled to the sacrificial layer;
forming one or more channels in the solid state device structure by removing one or more portions of the solid state device structure to expose one or more portions of the sacrificial layer;
after the one or more channels are formed, forming a molding support on the solid state device structure, the molding support exposing the one or more portions of the sacrificial layer;
after the molding support is formed, flowing an etching chemical through the one or more channels to the one or more portions of the sacrificial layer; and
dissolving the sacrificial layer by interaction between the etching chemical and the sacrificial layer, thereby separating the engineered substrate structure from the solid state device structure.
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Abstract
A method of processing an engineered substrate structure includes providing an engineered substrate structure including a polycrystalline substrate and an engineered layer encapsulating the polycrystalline substrate, forming a sacrificial layer coupled to the engineered layer, joining a solid state device structure to the sacrificial layer, forming one or more channels in the solid state device structure by removing one or more portions of the solid state device structure to expose one or more portions of the sacrificial layer, flowing an etching chemical through the one or more channels to the one or more exposed portions of the sacrificial layer, and dissolving the sacrificial layer by interaction between the etching chemical and the sacrificial layer, thereby separating the engineered substrate structure from the solid state device structure.
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Citations
18 Claims
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1. A method of processing an engineered substrate structure, the method comprising:
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providing an engineered substrate structure including; a polycrystalline substrate; and an engineered layer encapsulating the polycrystalline substrate; forming a sacrificial layer coupled to the engineered layer; forming a solid state device structure coupled to the sacrificial layer; forming one or more channels in the solid state device structure by removing one or more portions of the solid state device structure to expose one or more portions of the sacrificial layer; after the one or more channels are formed, forming a molding support on the solid state device structure, the molding support exposing the one or more portions of the sacrificial layer; after the molding support is formed, flowing an etching chemical through the one or more channels to the one or more portions of the sacrificial layer; and dissolving the sacrificial layer by interaction between the etching chemical and the sacrificial layer, thereby separating the engineered substrate structure from the solid state device structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of processing an engineered substrate structure, the method comprising:
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providing an engineered substrate structure including; a polycrystalline substrate; and an engineered layer encapsulating the polycrystalline substrate; forming a sacrificial layer coupled to the engineered layer, the sacrificial layer having an exposed periphery; forming a solid state device structure coupled to the sacrificial layer; forming a molding support on the solid state device structure; after the molding support is formed, applying an etching chemical to the exposed periphery of the sacrificial layer; and dissolving the sacrificial layer by interaction between the etching chemical and the sacrificial layer, thereby separating the engineered substrate structure from the solid state device structure. - View Dependent Claims (10, 11, 12, 13)
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14. A method of processing an engineered substrate structure, the method comprising:
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providing an engineered substrate structure including; a polycrystalline substrate; and an engineered layer encapsulating the polycrystalline substrate, the engineered layer having an exposed periphery; forming a solid state device structure coupled to the engineered layer; forming a molding support on the solid state device structure; after the molding support is formed, applying an etching chemical to the exposed periphery of the engineered layer; and dissolving the engineered layer by interaction between the etching chemical and the engineered layer, thereby separating the polycrystalline substrate from the solid state device structure. - View Dependent Claims (15, 16, 17, 18)
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Specification