Molded chip fabrication method and apparatus
First Claim
1. A light emitting diode (LED) comprising:
- a plurality of semiconductor layers defining a structure having a first surface, a second surface opposite the first surface, and at least one angled side;
a top contact coupled to the first surface;
a bottom contact coupled to the second surface; and
a coating layer comprising a cured binder and a conversion material, wherein the coating layer covers all of the at least one angled side and further covers a side surface of the top contact and a side surface of the bottom contact, wherein the surface of the coating layer adjacent to said top contact is planar and not above said top contact, wherein none of the coating layer is over the first surface of the structure;
in which a top surface of the top contact is exposed along a top surface of said LED and a bottom surface of the bottom contact is exposed along a bottom surface of the LED.
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Accused Products
Abstract
A light emitting diode (LED) is disclosed comprising a plurality of semiconductor layers with a first contact on the bottom surface of the semiconductor layers and a second contact on the top surface of the semiconductor layer. A coating is included that comprises a cured binder and a conversion material that at least partially covers the semiconductor layers, wherein the second contact extends through the coating and is exposed on the same plane as the top surface of the coating. An electrical signal applied to the first and second contacts is conducted through the coating to the semiconductor layers causing the LED to emit light. In other embodiments first and second contacts are accessible from one side of the LED. A coating is included that comprises a cured binder and a conversion material. The coating at least partially covers the semiconductor layers, with the first and second contacts extending through the coating and exposed on the same plane as a surface of the coating. An electrical signal applied to the first and second contacts is conducted through the coating to the semiconductor layers causing the LED to emit light.
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Citations
39 Claims
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1. A light emitting diode (LED) comprising:
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a plurality of semiconductor layers defining a structure having a first surface, a second surface opposite the first surface, and at least one angled side; a top contact coupled to the first surface; a bottom contact coupled to the second surface; and a coating layer comprising a cured binder and a conversion material, wherein the coating layer covers all of the at least one angled side and further covers a side surface of the top contact and a side surface of the bottom contact, wherein the surface of the coating layer adjacent to said top contact is planar and not above said top contact, wherein none of the coating layer is over the first surface of the structure; in which a top surface of the top contact is exposed along a top surface of said LED and a bottom surface of the bottom contact is exposed along a bottom surface of the LED. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A light emitting diode (LED) comprising:
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a plurality of semiconductor layers defining a structure having a bottom surface, a top surface opposite the bottom surface, and one or more angled sides; a first contact on the bottom surface of the structure. a second contact on the top surface of the structure; and a coating comprising a cured binder and a conversion material, wherein the coating layer covers all of the one or more angled sides and further covers a side surface of the first contact and a side surface of the second contact, wherein said first contact extends through said coating layer and is exposed as a bottom surface of the LED, said second contact extends through said coating layer and is exposed as a top surface of said LED, wherein said coating layer is planar adjacent to said first contact and is substantially cube shaped; and
wherein none of the coating layer is over the top surface of the structure. - View Dependent Claims (13, 14, 15, 16, 17, 18)
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19. A light emitting diode (LED), comprising:
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a plurality of semiconductor layers defining a structure having a bottom surface, a top surface opposite the bottom surface, and at least one angled side; a top contact on the plurality of semiconductor layers; a bottom contact opposite said top contact; and a coating layer comprising a cured binder and a conversion material, such that the coating layer covers all of the at least one angled side and further covers a side surface of the top contact and a side surface of the bottom contact, in which said top contact extends through said coating layer such that the coating layer is absent from an exposed surface of the top contact, wherein the surface of the coating layer adjacent said top contact is planar and the surface of the coating covering said angled side is planar; wherein light emitting from said LED passes through substantially the same thickness of said coating layer; and
wherein none of the coating layer is over the top surface of the structure. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27)
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28. A light emitting diode (LED), comprising:
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a plurality of semiconductor layers defining a structure having a bottom surface, a top surface opposite the bottom surface, and one or more angled sides; a top contact coupled to the plurality of semiconductor layers; a bottom contact coupled to the plurality of semiconductor layers opposite said top contact; a conformal coat layer of matrix material comprising a cured binder and a conversion material, wherein the conformal coat layer covers all of the one or more angled sides and further covers a side surface of the top contact and a side surface of the bottom contact, in which the top contact extends through the conformal coat layer such that the conformal coat layer is absent from an exposed surface of the top contact and such that none of the conformal coat layer is over the top surface of the structure, wherein the surface of the coating layer covering the side surface of said top contact is planar and not above said top contact. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39)
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Specification