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Molded chip fabrication method and apparatus

  • US 10,546,978 B2
  • Filed: 07/21/2009
  • Issued: 01/28/2020
  • Est. Priority Date: 09/18/2003
  • Status: Active Grant
First Claim
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1. A light emitting diode (LED) comprising:

  • a plurality of semiconductor layers defining a structure having a first surface, a second surface opposite the first surface, and at least one angled side;

    a top contact coupled to the first surface;

    a bottom contact coupled to the second surface; and

    a coating layer comprising a cured binder and a conversion material, wherein the coating layer covers all of the at least one angled side and further covers a side surface of the top contact and a side surface of the bottom contact, wherein the surface of the coating layer adjacent to said top contact is planar and not above said top contact, wherein none of the coating layer is over the first surface of the structure;

    in which a top surface of the top contact is exposed along a top surface of said LED and a bottom surface of the bottom contact is exposed along a bottom surface of the LED.

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