Chemical-mechanical planarization slurries and powders and methods for using same
First Claim
Patent Images
1. A powder batch comprising abrasive particles of an abrasive compound, wherein said abrasive particles are substantially spherical, have a weight average particle size of not greater than about 3 μ
- m and a particle size distribution wherein at least about 90 weight percent of said abrasive particles are not larger than twice said average particle size.
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Abstract
Chemical-mechanical planarization slurries and methods for using the slurries wherein the slurry includes abrasive particles. The abrasive particles have a small particle size, narrow size distribution and a spherical morphology and the particles are substantially unagglomerated.
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Citations
177 Claims
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1. A powder batch comprising abrasive particles of an abrasive compound, wherein said abrasive particles are substantially spherical, have a weight average particle size of not greater than about 3 μ
- m and a particle size distribution wherein at least about 90 weight percent of said abrasive particles are not larger than twice said average particle size.
- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
- 17. A chemical mechanical planarization slurry, comprising a liquid carrier and abrasive particles comprising an abrasive compound dispersed throughout said liquid carrier, wherein said abrasive particles are substantially spherical and have a weight average particle size of from about 0.1 to about 3 μ
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47. A chemical mechanical planarization slurry, comprising a liquid carrier and abrasive particles comprising an abrasive compound dispersed throughout said liquid carrier, wherein said abrasive particles have a weight average particle size of not greater than about 3 μ
- m and wherein said abrasive particles are coated abrasive particles.
- View Dependent Claims (48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65)
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66. A chemical mechanical planarization slurry, comprising a liquid carrier and abrasive particles dispersed throughout said liquid carrier, wherein said abrasive particles have a weight average particle size of not greater than about 3 μ
- m and wherein said abrasive particles are composite abrasive particles comprising a first abrasive compound and a second phase.
- View Dependent Claims (67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79, 80)
- 81. A chemical mechanical planarization slurry, comprising a liquid carrier and abrasive particles dispersed throughout said liquid carrier, wherein said abrasive particles comprise an abrasive compound, and are substantially spherical hollow particles having a weight average particle size of not greater than about 3 μ
- 88. A chemical mechanical planarization slurry, comprising a liquid carrier and abrasive particles dispersed throughout said liquid carrier, wherein said abrasive particles comprise a phosphor compound and have a weight average particle size of not greater than about 3 μ
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94. A chemical mechanical planarization slurry, comprising a liquid carrier and abrasive particles comprising an abrasive compound dispersed throughout said liquid carrier, wherein said abrasive particles are substantially spherical, have a weight average particle size of not greater than about 3 μ
- m and wherein not greater than about 3 weight percent of said particles are in the form of hard agglomerates.
- View Dependent Claims (95, 96, 97, 98, 99, 100, 101, 102, 103)
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104. A method for planarizing a substrate, comprising the steps of:
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a) providing a chemical-mechanical polishing slurry comprising abrasive articles of an abrasive compound dispersed in a liquid carrier, wherein said abrasive particles are substantially spherical, have a weight average particle size of not greater than about 3 μ
m and a particle size distribution wherein at least about 90 weight percent of said particles are not larger than twice said average particle size;
b) disposing said polishing slurry between a polishing pad and a substrate; and
c) rotating said pad under an applied pressure to abrade said slurry against said substrate and remove material from the surface of said substrate. - View Dependent Claims (105, 106, 107, 108, 109, 110, 111, 112, 113, 114, 115, 116, 117, 118, 119, 120, 121)
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122. A method for the production of abrasive particles adapted for use in a CMP slurry, comprising the steps of:
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a) generating an aerosol of droplets from a liquid wherein said liquid comprises an abrasive compound precursor and wherein said droplets have a size distribution such that at least about 80 weight percent of said droplets have a size of not greater than about 5 μ
m;
b) moving said droplets in a carrier gas; and
c) heating said droplets to remove liquid therefrom and form abrasive particles of said abrasive compound. - View Dependent Claims (123, 124, 125, 126, 127, 128, 129, 130, 131, 132, 133, 134, 135, 136)
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137. A method for the production of abrasive particles adapted for use in a CMP slurry, comprising the steps of:
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a) generating an aerosol of droplets from a liquid wherein said liquid comprises a silica precursor and wherein said droplets have a size distribution such that at least about 80 weight percent of said droplets have a size of not greater than about 5 μ
m;
b) moving said droplets in a carrier gas; and
c) heating said droplets to remove liquid therefrom and form abrasive particles comprising silica. - View Dependent Claims (138, 139, 140, 141, 142, 143, 144)
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145. A method for the production of abrasive particles adapted for use in a CMP slurry, comprising the steps of:
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a) generating an aerosol of droplets from a liquid wherein said liquid comprises an alumina precursor and wherein said droplets have a size distribution such that at least about 80 weight percent of said droplets have a size of less than about 5 μ
m;
b) moving said droplets in a carrier gas; and
c) heating said droplets to remove liquid therefrom and form abrasive particles comprising alumina. - View Dependent Claims (146, 147, 148, 149, 150, 151, 152, 153)
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154. A method for the production of abrasive compound particles adapted for use in a CMP slurry, comprising the steps of:
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a) generating an aerosol of droplets from a liquid wherein said liquid comprises a ceria precursor and wherein said droplets have a size distribution such that at least about 80 weight percent of said droplets have a size of less than about 5 μ
m;
b) moving said droplets in a carrier gas; and
c) heating said droplets to remove liquid therefrom and form abrasive particles comprising ceria. - View Dependent Claims (155, 156, 157, 158, 159, 160, 161, 162)
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163. A method for the production of coated abrasive particles, comprising the steps of:
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a) forming a liquid solution comprising an abrasive compound precursor;
b) generating an aerosol of droplets from said liquid solution;
c) moving said droplets in a carrier gas;
d) heating said droplets to remove liquid therefrom and form abrasive particles comprising said abrasive compound; and
e) coating an outer surface of said abrasive particles. - View Dependent Claims (164, 165, 166, 167, 168, 169, 170)
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171. A method for increasing yields during an integrated circuit manufacturing process incorporating at least one chemical mechanical planarization step, comprising the step of planarizing said integrated circuit using a CMP slurry, wherein said slurry comprises abrasive particles dispersed in a liquid carrier, wherein said abrasive particles are substantially spherical, have a weight average particle size of not greater than about 1 μ
- m and a particle size distribution wherein at least about 90 weight percent of said particles are not larger than twice said average particle size.
- View Dependent Claims (172, 173, 174, 175, 176)
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177. A method for planarizing an integrated circuit device, comprising the steps of:
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a) providing a chemical-mechanical polishing slurry comprising composite abrasive particles, wherein said composite abrasive particles have a weight average particle size of not greater than about 3 μ
m and wherein said composite abrasive particles comprise an abrasive compound and a luminescent compound;
b) disposing said polishing slurry between a polishing pad and a substrate;
c) rotating said pad under an applied pressure to abrade said slurry against said substrate and remove material from the surface of said substrate;
d) cleaning said substrate to remove slurry therefrom;
e) detecting residual slurry on said substrate by illuminating said substrate with a light source adapted to cause said luminescent compound to luminesce; and
f) removing residual slurry from said substrate.
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Specification