Chemical-mechanical planarization slurries and powders and methods for using same

• US 20020003225A1
• Filed: 01/02/2001
• Published: 01/10/2002
• Est. Priority Date: 02/24/1997
• Status: Active Grant

• Current Assignee: Cabot Corporation
• Original Assignee: Cabot Corporation
• Inventors: Hampden-Smith, Mark J., Caruso, James, Kodas, Toivo T., Powell, Quint H., Skamser, Daniel J.
• Granted Patent: US 6,730,245 B2
• Time in Patent Office: Days
• US Class Current: 252/79.1
• CPC Class Codes: B01J 2/003 followed by coating of the granules to prevent the granules sticking together B01J2/30
• CPC Class Codes: B01J 2/006 Coating of the granules without description of the process or the device by which the granules are obtained to prevent the granules sticking together B01J2/30
• CPC Class Codes: B01J 2/02 by dividing the liquid material into drops, e.g. by spraying, and solidifying the drops
• CPC Class Codes: B01J 2/04 in a gaseous medium if combined with suspending the material in a gas, e.g. fluidised beds B01J2/16
• CPC Class Codes: B01J 2219/00155 using insulating materials or refractories
• CPC Class Codes: B01J 2219/00159 controlling multiple zones along the direction of flow, e.g. pre-heating and after-cooling
• CPC Class Codes: B01J 2219/00162 controlling the pressure
• CPC Class Codes: B01J 2219/00166 controlling the residence time inside the reactor vessel
• CPC Class Codes: B01J 2219/00171 controlling the density
• CPC Class Codes: B01J 2219/00186 controlling the composition of the reactive mixture
• CPC Class Codes: B24B 37/044 characterised by the composition of the lapping agent
• CPC Class Codes: B82Y 30/00 Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: C01B 13/185 Preparing mixtures of oxides
• CPC Class Codes: C01B 17/20 Methods for preparing sulfides or polysulfides, in general ammonium sulfides or polysulfides C01C; sulfides or polysulfides of metals, other than alkali metals, magnesium, calcium, strontium and barium, see the relevant groups of subclasses C01F or C01G, according to the metal
• CPC Class Codes: C01F 17/235 Cerium oxides or hydroxides
• CPC Class Codes: C01G 15/006 Compounds containing, besides gallium, indium, or thallium, two or more other elements, with the exception of oxygen or hydrogen
• CPC Class Codes: C01G 23/003 Titanates C01G23/001 takes precedence
• CPC Class Codes: C01G 23/006 Alkaline earth titanates
• CPC Class Codes: C01G 25/00 Compounds of zirconium
• CPC Class Codes: C01P 2002/60 Compounds characterised by their crystallite size
• CPC Class Codes: C01P 2002/70 : defined by measured X-ray, neutron or electron diffraction data
• CPC Class Codes: C01P 2004/03 : obtained by SEM
• CPC Class Codes: C01P 2004/32 : Spheres
• CPC Class Codes: C01P 2004/34 : hollow
• CPC Class Codes: C01P 2004/50 : Agglomerated particles
• CPC Class Codes: C01P 2004/52 : highly monodisperse size distribution
• CPC Class Codes: C01P 2004/61 : Micrometer sized, i.e. from 1-100 micrometer
• CPC Class Codes: C01P 2004/62 : Submicrometer sized, i.e. from 0.1-1 micrometer
• CPC Class Codes: C01P 2004/80 : Particles consisting of a mixture of two or more inorganic phases
• CPC Class Codes: C01P 2006/10 : Solid density
• CPC Class Codes: C01P 2006/60 : Optical properties, e.g. expressed in CIELAB-values
• CPC Class Codes: C01P 2006/80 : Compositional purity
• CPC Class Codes: C09G 1/02 : containing abrasives or grinding agents abrasives as such C09K3/14; polishing of semi-conductors H01L
• CPC Class Codes: C09K 3/1436 : Composite particles, e.g. coated particles
• CPC Class Codes: C09K 3/1463 : Aqueous liquid suspensions
• CPC Class Codes: H01G 4/0085 : Fried electrodes
• CPC Class Codes: H01J 29/20 : characterised by the luminescent material
• CPC Class Codes: H01L 21/3212 : by chemical mechanical polishing [CMP]
• CPC Class Codes: H01L 23/49883 : the conductive materials containing organic materials or pastes, e.g. for thick films for printed circuits H05K1/092
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Chemical-mechanical planarization slurries and methods for using the slurries wherein the slurry includes abrasive particles. The abrasive particles have a small particle size, narrow size distribution and a spherical morphology and the particles are substantially unagglomerated.

Claims

1. A powder batch comprising abrasive particles of an abrasive compound, wherein said abrasive particles are substantially spherical, have a weight average particle size of not greater than about 3 μ

m and a particle size distribution wherein at least about 90 weight percent of said abrasive particles are not larger than twice said average particle size.

2. A powder batch as recited in claim 1, wherein at least about 95 weight percent of said abrasive particles are not larger than twice said average particle size.

3. A powder batch as recited in claim 1, wherein said weight average particle size is not greater than about 2 μ

m.

4. A powder batch as recited in claim 1, wherein said weight average particle size is not greater than about 1 μ

m.

5. A powder batch as recited in claim 1, wherein said weight average particle size is from about 0.1 μ

m to about 0.75 μ

m.

6. A powder batch as recited in claim 1, wherein said abrasive compound is a metal oxide.

7. A powder batch as recited in claim 1, wherein said abrasive compound is a metal oxide selected from the group consisting of Al₂O₃, SiO₂, CeO₂, TiO₂, MgO, ZrO₂, Fe₂O₃, Fe₃O₄, HfO₂, MnO₂, V₂O₅, SnO₂, ZnO, Cr₂O₃, Y₃Al₅O₁₂ and mixtures thereof.

8. A powder batch as recited in claim 1, wherein said abrasive compound is selected from the group consisting of Al₂O₃, SiO₂ and CeO₂.

9. A powder batch as recited in claim 1, wherein said abrasive compound is Al₂O₃.

10. A powder batch as recited in claim 1, wherein said abrasive compound is SiO₂.

11. A powder batch as recited in claim 1, wherein said abrasive compound is CeO₂.

12. A powder batch as recited in claim 1, wherein said abrasive particles have an average crystallite size of at least about 20 nanometers.

13. A powder batch as recited in claim 1, wherein said abrasive particles have a particle density that is at least about 90 percent of the theoretical density of said abrasive compound.

14. A powder batch as recited in claim 1, wherein said abrasive particles are hollow shells.

15. A powder batch as recited in claim 1, wherein no greater than about 1 weight percent of said abrasive particles are in the form of hard agglomerates.

16. A powder batch as recited in claim 1, wherein no greater than about 0.5 weight percent of said abrasive particles are in the form of hard agglomerates.

17. A chemical mechanical planarization slurry, comprising a liquid carrier and abrasive particles comprising an abrasive compound dispersed throughout said liquid carrier, wherein said abrasive particles are substantially spherical and have a weight average particle size of from about 0.1 to about 3 μ

m.

18. A slurry as recited in claim 17, wherein said particles have a particle size distribution wherein at least about 90 weight percent of said particles are not larger than twice said average particle size.

19. A slurry as recited in claim 17, wherein said abrasive compound is a metal oxide.

20. A slurry as recited in claim 17, wherein said abrasive compound is selected from the group consisting of Al₂O₃, SiO₂, CeO₂, TiO₂, MgO, ZrO₂, Fe₂O₃, Fe₃O₄, HfO₂, MnO₂, V₂O, SnO₂, ZnO, Cr₂O₃, Y₃Al₅O₁₂ and mixtures thereof.

21. A slurry as recited in claim 17, wherein said abrasive compound is selected from the group consisting of Al₂O₃, SiO₂, CeO₂ and mixtures thereof.

22. A slurry as recited in claim 17, wherein said abrasive compound is Al₂O₃.

23. A slurry as recited in claim 17, wherein said abrasive compound is SiO₂.

24. A slurry as recited in claim 17, wherein said abrasive compound is CeO₂.

25. A slurry as recited in claim 17, wherein said abrasive compound is ZrO₂.

26. A slurry as recited in claim 17, wherein said slurry comprises first abrasive particles of a first abrasive compound and second abrasive particles of a second abrasive compound.

27. A slurry as recited in claim 17, wherein at least about 95 weight percent of said abrasive particles are not larger than twice said average particle size.

28. A slurry as recited in claim 17, wherein said weight average particle size is not greater than about 1 μ

m.

29. A slurry as recited in claim 17, wherein said weight average particle size is from about 0.1 μ

m to about 0.75 μ

m.

30. A slurry as recited in claim 17, wherein said abrasive particles have an average crystallite size of at least about 20 nanometers.

31. A slurry as recited in claim 17, wherein not greater than about 1 weight percent of said abrasive particles are in the form of hard agglomerates.

32. A slurry as recited in claim 17, wherein said abrasive particles have a particle density of at least about 90 percent of the theoretical density of said abrasive compound.

33. A slurry as recited in claim 17, wherein said abrasive particles are hollow shells.

34. A slurry as recited in claim 17, wherein said liquid carrier is an aqueous-based slurry.

35. A slurry as recited in claim 17, wherein said slurry comprises from about 0.5 to about 60 weight percent of said abrasive particles.

36. A slurry as recited in claim 17, wherein said slurry comprises from about 1 to about 20 weight percent of said abrasive particles.

37. A slurry as recited in claim 17, wherein said liquid carrier is an aqueous-based slurry comprising an oxidizing agent.

38. A slurry as recited in claim 17, wherein said liquid carrier is an aqueous-based slurry comprising a complexing agent.

39. A slurry as recited in claim 17, wherein said abrasive particles are coated particles.

40. A slurry as recited in claim 17, wherein said abrasive particles are coated particles comprising a coating adapted to be consumed during use of said slurry in a polishing process.

41. A slurry as recited in claim 17, wherein said abrasive particles are coated articles comprising a metal oxide coating.

42. A slurry as recited in claim 17, wherein said abrasive particles are coated articles comprising an organic coating.

43. A slurry as recited in claim 17, wherein said abrasive particles are composite abrasive particles comprising a first abrasive compound and a second phase.

44. A slurry as recited in claim 17, wherein said abrasive particles are composite abrasive particles comprising a first abrasive compound and a luminescent compound.

45. A slurry as recited in claim 17, wherein said abrasive particles are composite abrasive particles comprising a first abrasive compound and a second abrasive compound.

46. A method for planarizing a substrate using a slurry as recited in claim 17.

47. A chemical mechanical planarization slurry, comprising a liquid carrier and abrasive particles comprising an abrasive compound dispersed throughout said liquid carrier, wherein said abrasive particles have a weight average particle size of not greater than about 3 μ

m and wherein said abrasive particles are coated abrasive particles.

48. A slurry as recited in claim 47, wherein said coated abrasive particles have a particle size distribution wherein at least about 90 weight percent of said particles are not larger than twice said average particle size.

49. A slurry as recited in claim 47, wherein said abrasive compound is a metal oxide.

50. A slurry as recited in claim 47, wherein said abrasive compound is selected from the group consisting of Al₂O₃, SiO₂, CeO₂, ZrO₂ and mixtures thereof.

51. A slurry as recited in claim 47, wherein said slurry comprises first coated abrasive particles of a first abrasive compound and second coated abrasive particles of a second abrasive compound.

52. A slurry as recited in claim 47, wherein said abrasive particles are substantially spherical.

53. A slurry as recited in claim 47, wherein said weight average particle size is not greater than about 2 μ

m.

54. A slurry as recited in claim 47, wherein said weight average particle size is from about 0.1 μ

m to about 0.75 μ

m.

55. A slurry as recited in claim 47, wherein not greater than about 1 weight percent of said abrasive particles are in the form of hard agglomerates.

56. A slurry as recited in claim 47, wherein said liquid carrier is an aqueous-based slurry.

57. A slurry as recited in claim 47, wherein said slurry comprises from about 0.5 to about 60 weight percent of said abrasive particles.

58. A slurry as recited in claim 47, wherein said coating has an average thickness of not greater than about 50 nanometers.

59. A slurry as recited in claim 47, wherein said coated abrasive particles comprise a coating adapted to be consumed during use of said slurry in a polishing process.

60. A slurry as recited in claim 47, wherein said coated abrasive particles comprise a metal oxide coating.

61. A slurry as recited in claim 47, wherein said coated abrasive particles comprise a CeO₂ coating.

62. A slurry as recited in claim 47, wherein said coated abrasive particles comprise an organic coating.

63. A slurry as recited in claim 47, wherein said coated abrasive particles comprise a monolayer coating.

64. A slurry as recited in claim 47, wherein said coated abrasive particles are coated composite abrasive particles comprising a first abrasive compound and a second phase.

65. A method for planarizing a substrate using a slurry as recited in claim 47.

66. A chemical mechanical planarization slurry, comprising a liquid carrier and abrasive particles dispersed throughout said liquid carrier, wherein said abrasive particles have a weight average particle size of not greater than about 3 μ

m and wherein said abrasive particles are composite abrasive particles comprising a first abrasive compound and a second phase.

67. A slurry as recited in claim 66, wherein at least about 90 weight percent of said particles are not larger than twice said average particle size.

68. A slurry as recited in claim 66, wherein said composite abrasive particles are substantially spherical.

69. A slurry as recited in claim 66, wherein said first abrasive compound is a metal oxide.

70. A slurry as recited in claim 66, wherein said first abrasive compound is selected from the group consisting of Al₂O₃, SiO₂, CeO₂, ZrO₂ and mixtures thereof.

71. A slurry as recited in claim 66, wherein said weight average particle size is not greater than about 2 μ

m.

72. A slurry as recited in claim 66, wherein said weight average particle size is not greater than about 1 μ

m.

73. A slurry as recited in claim 66, wherein not greater than about 3 weight percent of said abrasive particles are in the form of hard agglomerates.

74. A slurry as recited in claim 66, wherein said liquid carrier is an aqueous-based slurry.

75. A slurry as recited in claim 66, wherein said slurry comprises from about 0.5 to about 60 weight percent of said composite abrasive particles.

76. A slurry as recited in claim 66, wherein said composite abrasive particles are coated composite abrasive particles.

77. A slurry as recited in claim 66, wherein said second phase is a second abrasive compound.

78. A slurry as recited in claim 66, wherein said second phase is a luminescent compound.

79. A slurry as recited in claim 66, wherein said composite abrasive particles comprise a first abrasive compound selected from the group consisting of Al₂O₃ and SiO₂ and said second phase is CeO₂.

80. A method for planarizing a substrate using a slurry as recited in claim 66.

81. A chemical mechanical planarization slurry, comprising a liquid carrier and abrasive particles dispersed throughout said liquid carrier, wherein said abrasive particles comprise an abrasive compound, and are substantially spherical hollow particles having a weight average particle size of not greater than about 3 μ

m.

82. A slurry as recited in claim 81, wherein said average particle size is not greater than about 2 μ

m.

83. A slurry as recited in claim 81, wherein said abrasive compound is a metal oxide.

84. A slurry as recited in claim 81, wherein said abrasive compound is selected from the group consisting of Al₂O₃, SiO₂,CeO₂ and ZrO₂.

85. A slurry as recited in claim 81, wherein not greater than about 3 weight percent of said particles are in the form of hard agglomerates.

86. A slurry as recited in claim 81, wherein said slurry comprises from about 0.5 to about 60 weight percent of said particles.

87. A method for planarizing a substrate using a slurry as recited in claim 81.

88. A chemical mechanical planarization slurry, comprising a liquid carrier and abrasive particles dispersed throughout said liquid carrier, wherein said abrasive particles comprise a phosphor compound and have a weight average particle size of not greater than about 3 μ

m.

89. A slurry as recited in claim 88, wherein said average particle size is not greater than about 2 μ

m.

90. A slurry as recited in claim 88, wherein said average particle size is from about 0.1 μ

m to about 0.75 μ

m.

91. A slurry as recited in claim 88, wherein said abrasive particles are composite abrasive particles comprising an abrasive compound and a luminescent compound.

92. A slurry as recited in claim 88, wherein said slurry comprises from about 0.5 to about 60 weight percent of said abrasive particles.

93. A method for planarizing a substrate using a slurry as recited in claim 88.

94. A chemical mechanical planarization slurry, comprising a liquid carrier and abrasive particles comprising an abrasive compound dispersed throughout said liquid carrier, wherein said abrasive particles are substantially spherical, have a weight average particle size of not greater than about 3 μ

m and wherein not greater than about 3 weight percent of said particles are in the form of hard agglomerates.

95. A slurry as recited in claim 94, wherein said abrasive particles have a particle size distribution wherein at least about 90 weight percent of said particles are not larger than twice said average particle size.

96. A slurry as recited in claim 94, wherein said abrasive compound is a metal oxide.

97. A slurry as recited in claim 94, wherein said abrasive compound is selected from the group consisting of Al₂O₃, SiO₂, CeO₂, TiO₂ MgO, ZrO₂, Fe₂O₃, Fe₃O₄, HfO₂, MnO₂, V₂O, SnO₂, ZnO, Cr₂O₃, Y₃Al₅O₁₂ and mixtures thereof.

98. A slurry as recited in claim 94, wherein said abrasive compound is selected from the group consisting of Al₂O₃, SiO₂, CeO₂, ZrO₂ and mixtures thereof.

99. A slurry as recited in claim 94, wherein said weight average particle size is not greater than about 2 μ

m.

100. A slurry as recited in claim 94, wherein said weight average particle size is from about 0.1 μ

m to about 0.75 μ

m.

101. A slurry as recited in claim 94, wherein said abrasive particles have an average crystallite size of at least about 20 nanometers.

102. A slurry as recited in claim 94, wherein not greater than about 1 weight percent of said particles are in the form of hard agglomerates.

103. A method for planarizing a substrate using a slurry as recited in claim 94.

104. A method for planarizing a substrate, comprising the steps of:

a) providing a chemical-mechanical polishing slurry comprising abrasive articles of an abrasive compound dispersed in a liquid carrier, wherein said abrasive particles are substantially spherical, have a weight average particle size of not greater than about 3 μ

m and a particle size distribution wherein at least about 90 weight percent of said particles are not larger than twice said average particle size;

b) disposing said polishing slurry between a polishing pad and a substrate; and

c) rotating said pad under an applied pressure to abrade said slurry against said substrate and remove material from the surface of said substrate.

105. A method as recited in claim 104, wherein said abrasive compound is selected from the group consisting of Al₂O₃, SiO₂, CeO₂, TiO₂, MgO, ZrO₂, Fe₂O₃, Fe₃O₄, HfO₂, MnO₂, V₂O₅, SnO₂, ZnO, Cr₂O₃, Y₃Al₅O₁₂ and mixtures thereof.

106. A method as recited in claim 104, wherein said abrasive compound is selected from the group consisting of Al₂O₃, SiO₂, CeO₂, ZrO₂ and mixtures thereof.

107. A method as recited in claim 104, wherein said abrasive compound is Al₂O₃.

108. A method as recited in claim 104, wherein said abrasive compound is SiO₂.

109. A method as recited in claim 104, wherein said abrasive compound is CeO₂.

110. A method as recited in claim 104, wherein at least about 95 weight percent of said abrasive particles are not larger than twice said average particle size.

111. A method as recited in claim 104, wherein said average particle size is not greater than about 1 μ

m.

112. A method as recited in claim 104, wherein said average particle size is from about 0.1 μ

m to about 0.75 μ

m.

113. A method as recited in claim 104, wherein said abrasive particles have an average crystallite size of at least about 20 nanometers.

114. A method as recited in claim 104, wherein not greater than about 1 weight percent of said abrasive particles are in the form of hard agglomerates.

115. A method as recited in claim 104, wherein said abrasive particles have a particle density of at least about 90 percent of the theoretical density of said abrasive compound.

116. A method as recited in claim 104, wherein said abrasive particles are substantially spherical, hollow particles.

117. A method as recited in claim 104, wherein said liquid carrier is an aqueous-based solution.

118. A method as recited in claim 104, wherein said slurry comprises from about 0.5 to about 60 weight percent of said abrasive particles.

119. A method as recited in claim 104, wherein said liquid carrier is an aqueous-based solution comprising an oxidizing agent.

120. A method as recited in claim 104, wherein said substrate is an interlayer dielectric for an integrated circuit.

121. A method as recited in claim 104, wherein said substrate is a flat panel display screen.

122. A method for the production of abrasive particles adapted for use in a CMP slurry, comprising the steps of:

a) generating an aerosol of droplets from a liquid wherein said liquid comprises an abrasive compound precursor and wherein said droplets have a size distribution such that at least about 80 weight percent of said droplets have a size of not greater than about 5 μ

m;

b) moving said droplets in a carrier gas; and

c) heating said droplets to remove liquid therefrom and form abrasive particles of said abrasive compound.

123. A method as recited in claim 122, wherein said carrier gas comprises air.

124. A method as recited in claim 122, wherein said heating step comprises passing said droplets through a heating zone having a temperature of from about 400°

C. to about 1200°

C.

125. A method as recited in claim 122, wherein said abrasive particles have a particle density of at least about 90 percent of the theoretical density of said abrasive compound.

126. A method as recited in claim 122, wherein said droplets have a droplet size distribution such that no greater than about 20 weight percent of the droplets in said aerosol are larger than about twice the weight average droplet size.

127. A method as recited in claim 122, further comprising the step of removing a portion of droplets from said aerosol, wherein said removed droplets have an aerodynamic diameter greater than a preselected maximum diameter.

128. A method as recited in claim 122, wherein said liquid is an aqueous-based solution comprising an abrasive compound precursor selected from the group consisting of nitrates, hydroxides, chlorides, sulfates and oxalates.

129. A method as recited in claim 122, wherein said liquid comprises a colloidal suspension.

130. A method as recited in claim 122, further comprising the step of coating an outer surface of said abrasive particles.

131. A method as recited in claim 122, further comprising the step of coating an outer surface of said abrasive particles with a metal oxide coating.

132. A method as recited in claim 122, wherein said abrasive compound is selected from the group consisting of Al₂O₃, SiO₂, CeO₂ and ZrO₂.

133. A method as recited in claim 122, wherein said step of generating an aerosol comprises the step of using a plurality of ultrasonic transducers.

134. A method as recited in claim 122, wherein said step of generating an aerosol comprises the step of using a plurality of ultrasonic transducers having a frequency of at least about 1.7 MHz.

135. A method as recited in claim 122, wherein said liquid further comprises a densification aid.

136. A method as recited in claim 122, wherein said liquid further comprises urea.

137. A method for the production of abrasive particles adapted for use in a CMP slurry, comprising the steps of:

a) generating an aerosol of droplets from a liquid wherein said liquid comprises a silica precursor and wherein said droplets have a size distribution such that at least about 80 weight percent of said droplets have a size of not greater than about 5 μ

m;

b) moving said droplets in a carrier gas; and

c) heating said droplets to remove liquid therefrom and form abrasive particles comprising silica.

138. A method as recited in claim 137, wherein said carrier gas comprises air.

139. A method as recited in claim 137, wherein said heating step comprises passing said droplets through a heating zone having a temperature of from about 400°

C. to about 1200°

C.

140. A method as recited in claim 137, wherein said droplets have a size distribution such that no greater than about 20 weight percent of the droplets in said aerosol are larger than about twice the weight average droplet size.

141. A method as recited in claim 137, further comprising the step of removing a portion of droplets from said aerosol, wherein said removed droplets have an aerodynamic diameter greater than a preselected maximum diameter.

142. A method as recited in claim 137, wherein said liquid comprises a colloidal suspension.

143. A method as recited in claim 137, further comprising the step of coating an outer surface of said abrasive particles.

144. A method as recited in claim 137, wherein said step of generating an aerosol comprises the step of using a plurality of ultrasonic transducers having a frequency of at least about 1.7 MHz.

145. A method for the production of abrasive particles adapted for use in a CMP slurry, comprising the steps of:

a) generating an aerosol of droplets from a liquid wherein said liquid comprises an alumina precursor and wherein said droplets have a size distribution such that at least about 80 weight percent of said droplets have a size of less than about 5 μ

m;

b) moving said droplets in a carrier gas; and

c) heating said droplets to remove liquid therefrom and form abrasive particles comprising alumina.

146. A method as recited in claim 145, wherein said carrier gas comprises air.

147. A method as recited in claim 145, wherein said heating step comprises passing said droplets through a heating zone having a temperature of from about 400°

C. to about 1200°

C.

148. A method as recited in claim 145, wherein said droplets have a size distribution such that no greater than about 20 weight percent of the droplets in said aerosol are larger than about twice the weight average droplet size.

149. A method as recited in claim 145, further comprising the step of removing a portion of droplets from said aerosol, wherein said removed droplets have an aerodynamic diameter greater than a preselected maximum diameter.

150. A method as recited in claim 145, wherein said alumina precursor comprises aluminum nitrate.

151. A method as recited in claim 145, wherein said liquid comprises a colloidal suspension.

152. A method as recited in claim 145, further comprising the step of coating an outer surface of said abrasive particles.

153. A method as recited in claim 145, wherein said step of generating an aerosol comprises the step of using a plurality of ultrasonic transducers having a frequency of at least about 1.7 MHz.

154. A method for the production of abrasive compound particles adapted for use in a CMP slurry, comprising the steps of:

a) generating an aerosol of droplets from a liquid wherein said liquid comprises a ceria precursor and wherein said droplets have a size distribution such that at least about 80 weight percent of said droplets have a size of less than about 5 μ

m;

b) moving said droplets in a carrier gas; and

c) heating said droplets to remove liquid therefrom and form abrasive particles comprising ceria.

155. A method as recited in claim 154, wherein said carrier gas comprises air.

156. A method as recited in claim 154, wherein said heating step comprises passing said droplets through a heating zone having a temperature of from about 600°

C. to about 1100°

C.

157. A method as recited in claim 154, wherein said droplets have a size distribution such that no greater than about 20 weight percent of the droplets in said aerosol are larger than about twice the weight average droplet size.

158. A method as recited in claim 154, further comprising the step of removing a portion of droplets from said aerosol, wherein said removed droplets having aerodynamic diameter greater than a preselected maximum diameter.

159. A method as recited in claim 154, wherein said liquid is an aqueous-based solution comprising a ceria precursor selected from the group consisting of cerium ammonium nitrate, cerium nitrate and cerium chloride.

160. A method as recited in claim 154, wherein said liquid comprises a colloidal suspension.

161. A method as recited in claim 154, further comprising the step of coating an outer surface of said abrasive particles.

162. A method as recited in claim 154, wherein said step of generating an aerosol comprises the step of using ultrasonic transducers.

163. A method for the production of coated abrasive particles, comprising the steps of:

a) forming a liquid solution comprising an abrasive compound precursor;

b) generating an aerosol of droplets from said liquid solution;

c) moving said droplets in a carrier gas;

d) heating said droplets to remove liquid therefrom and form abrasive particles comprising said abrasive compound; and

e) coating an outer surface of said abrasive particles.

164. A method as recited in claim 163, wherein said abrasive compound is selected from the group consisting of Al₂O₃, SiO₂, CeO₂ and ZrO₂.

165. A method as recited in claim 163, wherein said coating comprises a compound selected from SiO₂ and Al₂O₃.

166. A method as recited in claim 163, wherein said coating comprises an organic compound.

167. A method as recited in claim 163, wherein said coating step comprises contacting said abrasive particles with a volatile coating precursor.

168. A method as recited in claim 163, wherein said coating step comprises contacting said metal particles with a volatile coating precursor selected from the group consisting of metal chlorides, metal acetates and metal alkoxides.

169. A method as recited in claim 163, wherein said abrasive compound precursor is a silica precursor and wherein said coating comprises alumina.

170. A method as recited in claim 163, wherein said coating is adapted to be consumed during use of said slurry in a polishing process.

171. A method for increasing yields during an integrated circuit manufacturing process incorporating at least one chemical mechanical planarization step, comprising the step of planarizing said integrated circuit using a CMP slurry, wherein said slurry comprises abrasive particles dispersed in a liquid carrier, wherein said abrasive particles are substantially spherical, have a weight average particle size of not greater than about 1 μ

m and a particle size distribution wherein at least about 90 weight percent of said particles are not larger than twice said average particle size.

172. A method as recited in claim 171, wherein said abrasive particles have a weight average particle size of from about 0.1 μ

m to about 0.75 μ

m.

173. A method as recited in claim 171, wherein at least about 90 weight percent of said particles are not larger than 1.5 times said average particle size.

174. A method as recited in claim 171, wherein said abrasive particles comprise alumina particles.

175. A method as recited in claim 171, wherein said abrasive particles comprise silica particles.

176. A method as recited in claim 171, wherein said abrasive particles comprise ceria particles.

177. A method for planarizing an integrated circuit device, comprising the steps of:

a) providing a chemical-mechanical polishing slurry comprising composite abrasive particles, wherein said composite abrasive particles have a weight average particle size of not greater than about 3 μ

m and wherein said composite abrasive particles comprise an abrasive compound and a luminescent compound;

b) disposing said polishing slurry between a polishing pad and a substrate;

c) rotating said pad under an applied pressure to abrade said slurry against said substrate and remove material from the surface of said substrate;

d) cleaning said substrate to remove slurry therefrom;

e) detecting residual slurry on said substrate by illuminating said substrate with a light source adapted to cause said luminescent compound to luminesce; and

f) removing residual slurry from said substrate.