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Method to prevent damage to probe card

  • US 20030122570A1
  • Filed: 12/20/2002
  • Published: 07/03/2003
  • Est. Priority Date: 06/25/2001
  • Status: Active Grant
First Claim
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1. A method of using a probe card for testing at least one semiconductor die, comprising:

  • providing a probe card having a plurality of probe elements connected thereto, the plurality of probe elements configured for supplying test signals to the at least one semiconductor die;

    providing a plurality of fuses in electrical communication with at least some of the plurality of probe elements; and

    testing the at least one semiconductor die by supplying test signals to the at least one semiconductor die through a fuse of the plurality of fuses.

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