Method to prevent damage to probe card
First Claim
1. A method of using a probe card for testing at least one semiconductor die, comprising:
- providing a probe card having a plurality of probe elements connected thereto, the plurality of probe elements configured for supplying test signals to the at least one semiconductor die;
providing a plurality of fuses in electrical communication with at least some of the plurality of probe elements; and
testing the at least one semiconductor die by supplying test signals to the at least one semiconductor die through a fuse of the plurality of fuses.
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Abstract
A method for probe cards configured with protective circuitry suitable for use in electrical testing of semiconductor dice without damage to the probe cards. In embodiments of the invention, protective fuses are provided in electrical communication with conductive traces and probe elements (e.g., probe needles) of a probe card. The fuses may be active or passive fuses and are preferably self-resetting, repairable, and/or replaceable. Typically, the fuses will be interposed in, or located adjacent to, conductive traces residing over a surface of the probe card. In this regard, methods of fabricating a probe card are provided, as well as various probe card configurations. A semiconductor die testing system using the probe card of the present invention is also provided.
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Citations
8 Claims
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1. A method of using a probe card for testing at least one semiconductor die, comprising:
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providing a probe card having a plurality of probe elements connected thereto, the plurality of probe elements configured for supplying test signals to the at least one semiconductor die;
providing a plurality of fuses in electrical communication with at least some of the plurality of probe elements; and
testing the at least one semiconductor die by supplying test signals to the at least one semiconductor die through a fuse of the plurality of fuses. - View Dependent Claims (2, 3, 4)
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5. A method for testing a semiconductor die, comprising:
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providing a probe card having a plurality of probe elements connected thereto, the plurality of probe elements configured for supplying test signals to the at least one semiconductor die;
providing a plurality of fuses in electrical communication with at least some of the plurality of probe elements; and
testing the at least one semiconductor die by supplying test signals to the at least one semiconductor die through a fuse of the plurality of fuses. - View Dependent Claims (6, 7, 8)
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Specification