Web lift system for chemical mechanical planarization

• US 20030171069A1
• Filed: 04/03/2003
• Published: 09/11/2003
• Est. Priority Date: 08/29/2000
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: White, John M., Somekh, Sasson, Sommer, Phillip R.
• Granted Patent: US 7,008,303 B2
• Time in Patent Office: Days
• US Class Current: 451/5
• CPC Class Codes: B24B 21/004 using abrasive rolled strips
• CPC Class Codes: B24B 21/008 Machines comprising two or more tools or having several working posts B24B21/006 takes precedence
• CPC Class Codes: B24B 21/20 for controlling or adjusting the tracking or the tension of the grinding belt
• CPC Class Codes: B24B 37/16 characterised by the shape of the lapping plate surface, e.g. grooved

Abstract

Generally, a method and system for lifting a web of polishing material is provided. In one embodiment, the system includes a platen that has a first lift member disposed adjacent to a first side and a second lift member disposed adjacent to a second side. The platen is adapted to support the web of polishing media that is disposed between the first and the second lift members. A method includes supporting a web of polishing media on a platen between a first lift member and a second lift member and moving at least the first lift member or the second lift member to an extended position relative the platen that places the web in a spaced-apart relation with the platen.

Claims