Vertical proximity processor
First Claim
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1. A method for processing a substrate, the substrate being substantially vertically oriented, comprising:
- generating a fluid meniscus on the surface of the vertically oriented substrate; and
moving the fluid meniscus over the surface of the vertically oriented substrate to process the surface of the substrate.
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Abstract
A method for processing a substrate is provided which includes generating a fluid meniscus on the surface of the vertically oriented substrate, and moving the fluid meniscus over the surface of the vertically oriented substrate to process the surface of the substrate.
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Citations
22 Claims
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1. A method for processing a substrate, the substrate being substantially vertically oriented, comprising:
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generating a fluid meniscus on the surface of the vertically oriented substrate; and
moving the fluid meniscus over the surface of the vertically oriented substrate to process the surface of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 18)
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10. A substrate preparation apparatus to be used in substrate processing operations, comprising:
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an arm capable of vertical movement between a first edge of the substrate to a second edge of the substrate; and
a head coupled to the arm, the head being capable of forming a fluid meniscus on a surface of the substrate and capable of being moved over the surface of the substrate. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17)
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19. A manifold for use in preparing a wafer surface, comprising:
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a first process window in a first portion of the manifold being configured generate a first fluid meniscus on the wafer surface; and
a second process window in a second portion of the manifold being configured to generate a second fluid meniscus on the wafer surface.
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- 20. A manifold for use in preparing a wafer surface as recited in claim 20, wherein the first fluid meniscus cleans the wafer surface and the second fluid meniscus cleans and dries the wafer surface.
Specification