Rapid thermal processing lamp and method for maufacturing the same

• US 20040099651A1
• Filed: 10/29/2003
• Published: 05/27/2004
• Est. Priority Date: 12/12/2000
• Status: Active Grant

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Johnson, Wayne L.
• Granted Patent: US 7,285,758 B2
• Time in Patent Office: Days
• US Class Current: 219/390
• CPC Class Codes: F27B 17/0025 Especially adapted for treating semiconductor wafers
• CPC Class Codes: H01L 21/67115 mainly by radiation
• CPC Class Codes: H05B 3/0047 for semiconductor manufacture
• CPC Class Codes: H05B 6/105 using a susceptor

Abstract

A method and system for inductively coupling energy to a heating filament (7A′, 7B′, 7C′, 7A, 7B, 7C) in a thermal processing environment. By applying AC power to a coil antenna (11) and inductive coupling to a filament (e.g., a halogen lamp filament), a number of connections that are subject to fatigue is reduced, thereby increasing the reliability of the heater (2A, 2B). Such an environment can be used to process semiconductor wafers (3) and liquid crystal displays.

Claims

1. In a thermal processing environment for heating a substrate, the improvement comprising:

a first inductively coupled filament for heating the substrate.

2. In the thermal processing environment as claimed in claim 1, wherein the first inductively coupled filament comprises an inductively coupled halogen lamp filament.

3. In the thermal processing environment as claimed in claim 2, further comprising a reflective shield for reflecting light towards the substrate.

4. In the thermal processing environment as claimed in claim 1, wherein the substrate comprises a semiconductor wafer.

5. In the thermal processing environment as claimed in claim 1, wherein the substrate comprises a liquid crystal display panel.

6. In the thermal processing environment as claimed in claim 1, further comprising a second inductively coupled filament.

7. In the thermal processing environment as claimed in claim 6, further comprising plural AC power sources for selectively powering the first and second inductively coupled filaments separately.

8. In the thermal processing environment as claimed in claim 7, further comprising an outer metal enclosure and a Faraday shield for blocking energy from one of the plural AC power sources from being coupled to the first inductively coupled filament while allowing the energy from the one of the plural AC power sources to be coupled to the second inductively coupled filament.

9. In the thermal processing environment as claimed in claim 1, further comprising a first cavity, between first and second isolation plates, for receiving the first inductively coupled filament.

10. In the thermal processing environment as claimed in claim 9, further comprising hairpins for supporting the first inductively coupled filament away from the first and second isolation plates.

11. In the thermal processing environment as claimed in claim 10, wherein the isolation plates comprise quartz plates.

12. In the thermal processing environment as claimed in claim 10, wherein the isolation plates comprise frit bonded quartz plates.

13. In the thermal processing environment as claimed in claim 10, wherein at least one of the isolation plates comprises a machined plate forming at least a portion of the first cavity.

14. In the thermal processing environment as claimed in claim 10, wherein the cavity comprises an anti-darkening agent.

15. In the thermal processing environment as claimed in claim 14, wherein the anti-darkening agent comprises iodine.

16. In the thermal processing environment as claimed in claim 14, wherein the anti-darkening agent comprises bromine.

17. In the thermal processing environment as claimed in claim 14, wherein the anti-darkening agent comprises a halogen gas.

18. In the thermal processing environment as claimed in claim 1, wherein the first inductively coupled filament comprises a tungsten filament.

19. In the thermal processing environment as claimed in claim 1, wherein the first inductively coupled filament comprises a tungsten alloy filament.

20. In the thermal processing environment as claimed in claim 10, further comprising a clamp for clamping together the isolation plates.