LIGHT EMITTING DIODE HAVING AN ADHESIVE LAYER AND A REFLECTIVE LAYER AND MANUFACTURING METHOD THEREOF
First Claim
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1. A method for manufacturing a light emitting diode having an adhesive layer and a reflective layer, comprising at least the steps of:
- forming an LED stack over a first substrate;
forming a first reaction layer over said LED stack;
forming a reflective layer over a second substrate;
forming a second reaction layer over said reflective layer; and
holding together said first reaction layer and said second reaction layer by means of a transparent adhesive layer.
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Abstract
A light emitting diode having an adhesive layer and a reflective layer and a manufacturing method thereof featured by adhering together a light emitting diode stack and a substrate having a reflective metal layer by use of a transparent adhesive layer so that the light rays directed to the reflective metal layer can be reflected therefrom to improve the brightness of the light emitting diode.
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Citations
43 Claims
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1. A method for manufacturing a light emitting diode having an adhesive layer and a reflective layer, comprising at least the steps of:
- forming an LED stack over a first substrate;
forming a first reaction layer over said LED stack;
forming a reflective layer over a second substrate;
forming a second reaction layer over said reflective layer; and
holding together said first reaction layer and said second reaction layer by means of a transparent adhesive layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
- forming an LED stack over a first substrate;
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10. A method for manufacturing a light emitting diode having an adhesive layer and a reflective layer, comprising at least the steps of:
- forming an LED stack over a first substrate;
forming a first reaction layer over said LED stack;
forming a second reaction layer over areflective metal substrate; and
holding together said first reaction layer and said second reaction layer by means of a transparent adhesive layer. - View Dependent Claims (11, 12, 13, 14, 15)
- forming an LED stack over a first substrate;
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16. A method for manufacturing a light emitting diode having an adhesive layer and a reflective layer, comprising at least the steps of:
- forming an LED stack over a first substrate;
forming a reflective layer over said LED stack;
forming a first reaction layer over said reflective layer;
forming a second reaction layer over a second substrate; and
holding together said first reaction layer and said second reaction layer by means of an adhesive layer. - View Dependent Claims (17, 18, 19, 20, 21, 22)
- forming an LED stack over a first substrate;
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23. A light emitting diode having an adhesive layer and a reflective layer, comprising at least:
- a substrate;
a reflective layer formed over the substrate;
a first reaction layer formed over said reflective layer;
a transparent adhesive layer formed over said first reaction layer;
a second reaction layer formed over said transparent adhesive layer; and
an LED stack formed over said second reaction layer. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30)
- a substrate;
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31. A light emitting diode having an adhesive layer and a reflective layer, comprising at least:
- a substrate;
a first reaction layer formed over the substrate;
a adhesive layer formed over said first reaction layer;
a second reaction layer formed over said adhesive layer;
a reflective layer formed over said second reaction layer; and
an LED stack formed over said reflective layer. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38)
- a substrate;
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39. A light emitting diode having an adhesive layer and a reflective layer, comprising at least:
- a reflective metal substrate;
a first reaction layer formed over the reflective metal substrate;
a transparent adhesive layer formed over said first reaction layer;
a second reaction layer formed over said transparent adhesive layer; and
an LED stack formed over said second reaction layer. - View Dependent Claims (40, 41, 42, 43)
- a reflective metal substrate;
Specification