Diode housing
First Claim
1. An apparatus for sending or receiving radiation, comprising:
- a housing having a top portion and a base, said top portion including walls defining an opening with an open top and a closed bottom;
a conductor accommodated within said housing, said conductor having two electrically isolated portions, a first portion having a first end terminating in an electrode external to said housing and a second end having a first open area exposed along said closed bottom such that said first portion is substantially surrounded by said housing but for said open area, and a second portion having a third end terminating in an electrode external to said housing and a fourth end having a second open area exposed along said closed bottom such that said second portion is substantially surrounded by said housing but for said second open area;
a semiconductor chip bonded to said first open area such that said semiconductor chip is positioned within said opening and said first open area is limited in area by said housing to substantially only accommodating said semiconductor chip;
a wire having a first end bonded to said semiconductor chip and a second end bonded to said second open area such that said wire is positioned within said opening and said second open area is limited by said housing to substantially only accommodate said wire bond; and
a window formed within said opening such that a top of said window is coplanar with a top of said housing.
7 Assignments
0 Petitions
Accused Products
Abstract
A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes a cavity extending inwards from the top of the housing. The conductor portions include respective areas that are exposed at the bottom of the cavity. The semiconductor chip is bonded to one of the exposed areas and a wire bonds the chip to the second exposed area. The conductor portions also terminate in exposed electrodes, which allow for electrical connection of the chip with external devices. A window is formed in the cavity and the walls of the housing that form the cavity may be made of a reflective material. The electrodes remain unexposed to the window but for any residual areas about the chip and bonding wire within the first and second exposed areas. By minimizing the area of the conductor exposed to the window, delamination brought about by the different thermal expansions of the window and conductor are minimized and/or eliminated. Likewise, with a reflective housing covering the base of the cavity that accommodates the window, internal radiation reflection is increased over that which was achieved with an exposed conductor.
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Citations
20 Claims
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1. An apparatus for sending or receiving radiation, comprising:
a housing having a top portion and a base, said top portion including walls defining an opening with an open top and a closed bottom;
a conductor accommodated within said housing, said conductor having two electrically isolated portions, a first portion having a first end terminating in an electrode external to said housing and a second end having a first open area exposed along said closed bottom such that said first portion is substantially surrounded by said housing but for said open area, and a second portion having a third end terminating in an electrode external to said housing and a fourth end having a second open area exposed along said closed bottom such that said second portion is substantially surrounded by said housing but for said second open area;
a semiconductor chip bonded to said first open area such that said semiconductor chip is positioned within said opening and said first open area is limited in area by said housing to substantially only accommodating said semiconductor chip;
a wire having a first end bonded to said semiconductor chip and a second end bonded to said second open area such that said wire is positioned within said opening and said second open area is limited by said housing to substantially only accommodate said wire bond; and
a window formed within said opening such that a top of said window is coplanar with a top of said housing. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An apparatus for sending and receiving radiation, comprising:
a housing having a top portion and a base, said top portion including walls defining an opening with an open top and a closed bottom;
a conductor accommodated within said housing, said conductor having two electrically isolated portions, a first portion having a first end terminating in an electrode external to said housing and a second end having a first open area exposed along said closed bottom such that said first portion is substantially surrounded by said housing but for said open area, and a second portion having a third end terminating in an electrode external to said housing and a fourth end having a second open area exposed along said closed bottom such that said second portion is substantially surrounded by said housing but for said second open area;
a semiconductor chip bonded to said first open area such that said semiconductor chip is positioned within said opening and said first open area is limited in area by said housing to substantially only accommodating said semiconductor chip;
a wire having a first end bonded to said semiconductor chip and a second end bonded to said second open area such that said wire is positioned within said opening and said second open area is limited by said housing to substantially only accommodate said wire bond; and
a window formed within said opening such that a top of said window is coplanar with a top of said housing. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method of forming a housing for a semiconductor chip, said method comprising the steps of:
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preparing a lead frame having multiple portions, a first portion having a first open area and said second portion having a second open area;
bonding a semiconductor to said first open area;
bonding a first end of a wire to said semiconductor and a second end of said wire to said second open area;
injection molding a housing about said first and second portions such that said first and second open areas are exposed in an opening and the rest of the first and second portions are covered by said housing; and
forming a transparent window in said opening. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification