Optical device and method of manufacture thereof, and electronic instrument

• US 20040158977A1
• Filed: 02/17/2004
• Published: 08/19/2004
• Est. Priority Date: 11/10/2000
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Murata, Akihiro
• Granted Patent: US 7,096,579 B2
• Time in Patent Office: Days
• US Class Current: 29/832
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15151 the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01S 5/0222 Gas-filled housings
• CPC Class Codes: H01S 5/02234 Resin-filled housings; the housings being made of resin
• CPC Class Codes: H01S 5/02325 Mechanically integrated components on mount members or optical micro-benches
• CPC Class Codes: H01S 5/0237 by soldering
• CPC Class Codes: H01S 5/183 having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/53191 Means to apply vacuum directly to position or hold work part

Abstract

The invention provides an optical device having an optical element, a substrate, and a flexible member. A first portion of the flexible member is disposed so as to be spaced from the substrate, a second portion surrounding the first portion is adhered to the substrate, and a closed space is defined between the first portion and the substrate. The optical element is mounted on the substrate within the closed space.

Claims

1. A method of manufacturing an optical device, comprising:

mounting an optical element on a substrate;

adhering a flexible member to the substrate so as to cover the optical element, to define a closed space between the substrate and the flexible member; and

evacuating the closed space.

2. The method of manufacturing an optical device as defined in claim 1,

the evacuating step being performed through a penetrating hole defined in the substrate, and further including the step of blocking the hole with resin.

3. The method of manufacturing an optical device as defined in claim 1,

the evacuating step being performed through a penetrating hole defined in the substrate, and further including the step of blocking the hole with a valve.

4. The method of manufacturing an optical device as defined in claim 1,

the evacuating step being performed through a penetrating hole defined in the substrate, and further including the step of blocking the hole with the flexible member.

5. The method of manufacturing an optical device as defined in claim 1, the evacuating step being performed through a penetrating hole, and further including the steps of:

filling the closed space with a transparent resin, and

blocking the hole with the transparent resin.