Method for packaging an image sensor
First Claim
1. A method for packaging an image sensor, comprising the steps of;
- providing a substrate having an upper surface and a lower surface;
mounting a frame layer to the upper surface of the substrate to form a chamber together with the substrate;
mounting a photosensitive chip to the upper surface of the substrate and within the chamber, and electrically connecting the photosensitive chip to the substrate;
mounting a transparent layer to the frame layer with a B-stage adhesive applied therebetween;
pre-baking the B-stage adhesive to slightly adhere the transparent layer to the frame layer;
testing the image sensor to determine whether the image sensor is passed or failed; and
post-baking the passed image sensor to completely cure the B-stage adhesive so that the transparent layer is firmly adhered to the frame layer.
1 Assignment
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Accused Products
Abstract
A method for packaging an image sensor includes the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer to the upper surface of the substrate to form a chamber together with the substrate; mounting a photosensitive chip to the upper surface of the substrate and within the chamber, and electrically connecting the photosensitive chip to the substrate; mounting a transparent layer to the frame layer with a B-stage adhesive applied therebetween; pre-baking the B-stage adhesive to slightly adhere the transparent layer to the frame layer; testing the image sensor to determine whether the image sensor is passed or failed; and post-baking the passed image sensor to completely cure the B-stage adhesive so that the transparent layer is firmly adhered to the frame layer.
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Citations
4 Claims
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1. A method for packaging an image sensor, comprising the steps of;
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providing a substrate having an upper surface and a lower surface;
mounting a frame layer to the upper surface of the substrate to form a chamber together with the substrate;
mounting a photosensitive chip to the upper surface of the substrate and within the chamber, and electrically connecting the photosensitive chip to the substrate;
mounting a transparent layer to the frame layer with a B-stage adhesive applied therebetween;
pre-baking the B-stage adhesive to slightly adhere the transparent layer to the frame layer;
testing the image sensor to determine whether the image sensor is passed or failed; and
post-baking the passed image sensor to completely cure the B-stage adhesive so that the transparent layer is firmly adhered to the frame layer. - View Dependent Claims (2, 3, 4)
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Specification