System and method for inductive coupling of an expanding thermal plasma

• US 20040263083A1
• Filed: 06/30/2003
• Published: 12/30/2004
• Est. Priority Date: 06/30/2003
• Status: Active Grant

• Current Assignee: SABIC Global Technologies BV (Government of Saudi Arabia)
• Original Assignee: General Electric Company
• Inventors: Schaepkens, Marc
• Granted Patent: US 6,969,953 B2
• Time in Patent Office: Days
• US Class Current: 315/111.21
• CPC Class Codes: H01J 37/321 the radio frequency energy being inductively coupled to the plasma
• CPC Class Codes: H01J 37/32357 Generation remote from the workpiece, e.g. down-stream
• CPC Class Codes: H05H 1/46 using applied electromagnetic fields, e.g. high frequency or microwave energy H05H1/26 takes precedence

Abstract

A method is provided for generating plasma using a plasma generator system. The method includes the steps of introducing energy and a reactant to a plasma generation apparatus of the plasma generator system for generating plasma, and expanding and inductively coupling the generated plasma. In another embodiment a plasma generation system is provided including a plasma generation apparatus for generating thermal plasma. The thermal plasma is received by a plasma treatment chamber external to the plasma generation apparatus. A pressure control system maintains a lower pressure in the plasma treatment chamber than in the plasma generation apparatus during plasma generation for causing the thermal plasma to expand within the plasma treatment chamber. An inductor system inductively couples the thermal plasma.

Claims

1. A method for generating plasma using a plasma generator system, said method comprising the steps of:

introducing energy and a reactant to a plasma generation apparatus of the plasma generator system for generating plasma; and

expanding and inductively coupling the generated plasma.

2. The method according to claim 1, wherein the step of inductively coupling comprises the steps of providing at least one electric coil in proximity to the generated plasma and energizing the at least one electric coil.

3. The method according to claim 2, further comprising the step of providing a substrate having at least one surface;

,

using the expanded and inductively coupled plasma to coat the surface of the substrate with at least one coating having a particular configuration; and

positioning the at least one electric coil in a particular configuration for generating a particular deposition profile corresponding to the particular configuration for the at least one coating on the surface of the substrate.

4. The method according to claim 3, wherein the particular configuration of the at least one electric coil is a substantially annular configuration.

5. The method according to claim 1, wherein the plasma is used to treat a surface for treatment selected from the group of treatments consisting of etching, roughening, heating, cleaning, and applying a coating to the surface.

6. The method according to claim 1, further including the step of introducing a reagent into the generated plasma.

7. The method according to claim 1, further including the steps of:

receiving the generated plasma in a plasma treatment chamber; and

maintaining a lower pressure in the plasma treatment chamber than in the plasma generation apparatus.

8. The method according to claim 1, wherein the generated plasma is a thermal plasma.

9. A plasma generation system comprising:

a plasma generation apparatus for generating thermal plasma;

a plasma treatment chamber external to said plasma generation apparatus receiving the thermal plasma from the plasma generation apparatus;

a pressure control system for maintaining a lower pressure in the plasma treatment chamber than in the plasma generation apparatus during plasma generation for causing the thermal plasma to expand within the plasma treatment chamber; and

an inductor system for inductively coupling the thermal plasma.

10. The system according to claim 9, wherein the expanded and inductively coupled plasma is directed towards a surface of a substrate within the plasma treatment chamber for coating the surface with at least one coating.

11. The system according to claim 9, wherein the inductor system includes at least one electric coil in proximity to the thermal plasma and a power source for energizing the at least one electric coil.

12. The system according to claim 10, wherein the at least one electric coil is positioned within the plasma treatment chamber in a particular configuration for generating a particular deposition profile corresponding to the particular configuration for the at least one coating on the surface of the substrate.

13. The system according to claim 12, wherein the particular configuration of the at least one electric coil is a substantially annular configuration.

14. The system according to claim 9, wherein the expanded and inductively coupled plasma is used to treat a surface for treatment selected from the group of treatments consisting of etching, roughening, heating, cleaning, and applying a coating to the surface.

15. The system according to claim 9, the plasma treatment chamber further comprising a port for receiving a reagent for reacting with the expanded and inductively coupled thermal plasma for dissociation along an electron impact dissociation path and a dissociative recombination path.

16. A plasma generation system comprising:

an apparatus for generating a plasma;

an apparatus for receiving the generated plasma and providing for expansion of the generated plasma, and

an apparatus for inductively coupling the generated plasma;

wherein the apparatus for receiving and the apparatus for inductively coupling together form the generated plasma into an inductively coupled and expanded plasma.

17. The system according to claim 16, wherein the apparatus for inductively coupling the generated plasma includes at least one electric coil in proximity to the generated plasma.

18. The system according to claim 16, wherein the generated plasma is a thermal plasma.

19. A plasma generator system comprising:

means for generating plasma by introducing energy and a reactant to the plasma generator system; and

means for expanding and inductively coupling the generated plasma.

20. An expanding inductively coupled plasma, said plasma generated by the method comprising the steps of:

introducing energy and a reactant to a plasma generation apparatus of a plasma generator system for generating plasma; and

expanding and inductively coupling the generated plasma.

21. An object having at least one surface, the surface treated using an expanding inductively coupled plasma, said plasma generated by the method comprising the steps of:

introducing energy and a reactant to a plasma generation apparatus of a plasma generator system for generating plasma; and

expanding and inductively coupling the generated plasma.