Solid metal block mounting substrates for semiconductor light emitting devices, and oxidizing methods for fabricating same

• US 20050051789A1
• Filed: 09/09/2003
• Published: 03/10/2005
• Est. Priority Date: 09/09/2003
• Status: Active Grant

• Current Assignee: CREE Led Incorporated (Smart Global Holdings Incorporated)
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Negley, Gerald H., Loh, Ban
• Granted Patent: US 7,183,587 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting

Abstract

A mounting substrate for a semiconductor light emitting device includes a solid metal block having a cavity in a face thereof that is configured for mounting a semiconductor light emitting device therein. An insulating coating is provided in the cavity, and first and second spaced apart conductive traces are provided on the insulating coating in the cavity that are configured for connection to a semiconductor light emitting device. The mounting substrate may be fabricated by providing a solid aluminum block including a cavity in a face thereof that is configured for mounting a semiconductor light emitting device therein. The solid aluminum block is oxidized to form an aluminum oxide coating thereon. The first and second spaced apart electrical traces are fabricated on the aluminum oxide coating in the cavity.

Claims

1. A mounting substrate for a semiconductor light emitting device comprising:

a solid metal block including a cavity in a face thereof that is configured for mounting a semiconductor light emitting device therein.

2. A mounting substrate according to claim 1 further comprising an insulating coating on a surface of the solid metal block.

3. A mounting substrate according to claim 2 wherein the insulating coating is in the cavity, the mounting substrate further comprising first and second spaced apart conductive traces on the insulating coating in the cavity that are configured for connection to a semiconductor light emitting device.

4. A mounting substrate according to claim 3 wherein face is a first face and wherein the first and second spaced apart conductive traces extend from the cavity to the first face, around at least one side of the metal block and onto a second face of the metal block that is opposite the first face.

5. A mounting substrate according to claim 3 wherein the first and second spaced apart conductive traces on the insulating coating in the cavity comprise reflective material.

6. A mounting substrate according to claim 3 wherein the face is a first face and wherein the solid metal block includes therein first and second through holes that extend from the first face to a second face of the solid metal block that is opposite the first face, the respective first and second through holes including a respective first and second conductive via therein that extends from the first face to the second face and wherein a respective one of the spaced apart conductive traces is electrically connected to a respective one of the conductive vias.

7. A mounting substrate according to claim 6 wherein the first and second through holes extend from the cavity to the second face.

8. A mounting substrate according to claim 2 wherein the solid metal block is a solid aluminum block and wherein the insulating coating comprises aluminum oxide.

9. A mounting substrate according to claim 8 wherein the face is a first face and wherein the solid aluminum block includes therein first and second through holes that extend from the first face to a second face of the solid aluminum block that is opposite the first face, the respective first and second through holes including the insulating coating thereon that comprises aluminum oxide and a respective first and second conductive via therein that extends from the first face to the second face and wherein a respective one of the spaced apart conductive traces is electrically connected to a respective one of the conductive vias.

10. A mounting substrate according to claim 6 further comprising third and fourth spaced apart conductive traces on the second face of the solid metal block, a respective one of which is connected to a respective one of the conductive vias.

11. A mounting substrate according to claim 3 in combination with a semiconductor light emitting device that is mounted in the cavity and is connected to the first and second spaced apart conductive traces.

12. A mounting substrate according to claim 11 in further combination with a lens that extends across the cavity.

13. A mounting substrate according to claim 12 in further combination with an encapsulant between the semiconductor light emitting device and the lens.

14. A mounting substrate according to claim 12 in further combination with a lens retainer on the solid metal block that is configured to hold the lens across the cavity.

15. A light emitting device comprising:

a solid aluminum block including a cavity in a face thereof and an aluminum oxide coating on a surface thereof including on the cavity;

first and second spaced apart conductive traces on the aluminum oxide coating in the cavity;

a semiconductor light emitting device that is mounted in the cavity and is connected to the first and second spaced apart conductive traces, a lens that extends across the cavity; and

an encapsulant between the semiconductor light emitting device and the lens.

16. A light emitting device according to claim 15 wherein the face is a first face and wherein the first and second spaced apart conductive traces extend from the cavity to the first face, around at least one side of the solid aluminum block and onto a second face of the solid aluminum block that is opposite the first face.

17. A light emitting device according to claim 15 wherein the first and second spaced apart conductive traces on the aluminum oxide coating in the cavity comprise reflective material.

18. A light emitting device according to claim 15 wherein the face is a first face and wherein the solid aluminum block includes first and second through holes that extend from the first face to a second face of the solid aluminum block that is opposite the first face, the respective first and second through holes including the aluminum oxide coating thereon and a respective first and second conductive via therein that extends from the first face to the second face and wherein a respective one of the spaced apart conductive traces is electrically connected to a respective one of the conductive vias.

19. A light emitting device according to claim 18 wherein the first and second through holes extend from the cavity to the second face.

20. A light emitting device according to claim 18 further comprising third and fourth spaced apart conductive traces on the second face of the solid aluminum block, a respective one of which is connected to a respective one of the conductive vias.

21-28. -28. (Canceled)